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Full-Text Articles in Engineering
Field Extraction From Near Field Scanning For A Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. Dubroff, James L. Drewniak, David Pommerenke, Todd H. Hubing
Field Extraction From Near Field Scanning For A Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. Dubroff, James L. Drewniak, David Pommerenke, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Currents associated with high-speed digital devices have significant impacts on EMI problems in VLSI design and operation. In this paper, a simple transmission line model was implemented as an initial step to represent the EMI mechanisms associated with an IC package. Numerical modeling results were compared with near field scanning measurements and show that the magnetic field deduced from the measurements agrees well with the numerical predictions.
Alternatives To Gaskets In Shielding An Enclosure, Federico Centola, David Pommerenke, James L. Drewniak, Xiao Kai
Alternatives To Gaskets In Shielding An Enclosure, Federico Centola, David Pommerenke, James L. Drewniak, Xiao Kai
Electrical and Computer Engineering Faculty Research & Creative Works
It is well known that a properly placed conductive gasket can complete an enclosure to yield good shielding. But often there are reasons, e.g. control of mechanical dimensions that this cannot be achieved. For these cases, one may want to avoid using a gasket that requires contacts. This paper will analyze alternatives to continuously contacting gaskets such as overlap structures, overlapping structures with different lossy and non-lossy materials, and overlaps with grounding points. It will compare structures by sufficient shielding for a typical class B product, high frequency (1-3 GHz) and low frequency (below 1 GHz) performance.
Anticipating Full Vehicle Radiated Emi From Module-Level Testing In Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, James L. Drewniak
Anticipating Full Vehicle Radiated Emi From Module-Level Testing In Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
EMI due to common-mode currents on cables routed in automobiles was studied using a test device designed to mimic a vehicle. Both experimental work and Finite-Difference Time-Domain (FDTD) modeling were employed in this paper. The good agreement between the measurements and modeling results indicates that the numerical tools can be a useful aid in predicting vehicle-level EMI by developing vehicle transfer functions and measuring the module-level EMI characteristics on the bench top.
Estimating Dc Power Bus Noise, Jingkun Mao, Bruce Archambeault, James L. Drewniak, Thomas Van Doren
Estimating Dc Power Bus Noise, Jingkun Mao, Bruce Archambeault, James L. Drewniak, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noise, as well as radiation problems. An approach for estimating the power bus noise spectrum is presented in this paper. The power bus noise caused by digital circuits injecting high-frequency noise onto the DC buses feeding digital devices is calculated. The transient current drawn by an IC device is modeled using the load current and the shoot-through current through the power dissipation capacitance. Modeling and experimental results for several digital chips are shown. The modeling agrees well with the experimental results.
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained.
Estimating The Noise Mitigation Effect Of Local Decoupling In Printed Circuit Boards, Jun Fan, Wei Cui, James L. Drewniak, Thomas Van Doren, James L. Knighten
Estimating The Noise Mitigation Effect Of Local Decoupling In Printed Circuit Boards, Jun Fan, Wei Cui, James L. Drewniak, Thomas Van Doren, James L. Knighten
Electrical and Computer Engineering Faculty Research & Creative Works
Local decoupling, i.e., placing decoupling capacitors sufficiently close to device power/ground pins in order to decrease the impedance of power bus at frequencies higher than the series resonant frequency, has been studied using a modeling approach, a hybrid lumped/distributed circuit model established and an expression to quantify the benefits of power bus noise mitigation due to local decoupling developed. In this work, a test board with a local decoupling capacitor was studied and the noise mitigation effect due to the capacitor placed adjacent to an input test port was measured. Closed-form expressions for self and mutual inductances of vias are …
Fdtd Modeling Of Skin Effect, Chen Wang, James L. Drewniak, Min Li, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Jingyu Huang
Fdtd Modeling Of Skin Effect, Chen Wang, James L. Drewniak, Min Li, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Jingyu Huang
Electrical and Computer Engineering Faculty Research & Creative Works
The data rates and clock speeds of current highspeed signals are increasing rapidly, consequently, not only the lossy nature of FR-4 but also the lossy nature of good conductors, such as copper, need to be taken into account in high-speed signal designs. In order to well predict the loss caused by both dielectric loss and skin effect loss, a suitable simulation tool is needed. A surface impedance boundary condition (SIBC) algorithm was implemented in FDTD modeling herein to accommodate the skin effect loss due to finite conductivity of good conductors. Good agreement between the FDTD result and the measurements as …
An Expert System Architecture To Detect System-Level Automotive Emc Problems, Sreeniwas Ranganathan, Daryl G. Beetner, R. Wiese, Todd H. Hubing
An Expert System Architecture To Detect System-Level Automotive Emc Problems, Sreeniwas Ranganathan, Daryl G. Beetner, R. Wiese, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Improving EMC in automobiles requires methods to detect potential problems early in the design process. Issues involved in the development of a system-level automotive EMC expert system are explored. The proposed system would help identify problems with radiation and immunity, crosstalk, placement of modules, component grounding and EMC testing. The architecture of the expert system has been developed. The system architecture is designed to allow rapid analysis of automobile designs, to point out potential problems and to suggest possible solutions.