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Full-Text Articles in Engineering
Complex Power Distribution Network Investigation Using Spice Based Extraction From First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault, Stefano Grivet-Talocia, Flavio G. Canavero
Complex Power Distribution Network Investigation Using Spice Based Extraction From First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault, Stefano Grivet-Talocia, Flavio G. Canavero
Electrical and Computer Engineering Faculty Research & Creative Works
The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
Validation Of Circuit Extraction Procedure By Means Of Frequency And Time Domain Measurement, Giulio Antonini, Antonio Ciccomancini Scogna, Antonio Orlandi, Vittorio Ricchiuti, Giuseppe Selli, Shaofeng Luan, James L. Drewniak
Validation Of Circuit Extraction Procedure By Means Of Frequency And Time Domain Measurement, Giulio Antonini, Antonio Ciccomancini Scogna, Antonio Orlandi, Vittorio Ricchiuti, Giuseppe Selli, Shaofeng Luan, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Aim of this paper is the validation in both frequency and time domain of the procedure to extract fully H-Spice compatible equivalent circuits of structures on printed circuit boards. The procedure is initiated by standard measurement of scattering parameters between 40MHz to 20GH. After the extraction of the equivalent circuit, the computed scattering parameters are compared with those measured. The same equivalent circuit is also used for transient analysis in order to compare TDR measurement and eye-pattern to a pseudo-random bit sequence with those coming from the simulations.
Power Integrity Investigation Of Bga Footprints By Means Of The Segmentation Method, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault
Power Integrity Investigation Of Bga Footprints By Means Of The Segmentation Method, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault
Electrical and Computer Engineering Faculty Research & Creative Works
The engineering of the power delivery network is becoming a fundamental issue in the design of high speed digital systems on PCB's. In fact, providing the required power to the different IC's at the specified noisefree voltage levels allows a correct functioning of the overall PCB systems. More over, the ongoing trend of replacing active devices with peripherally located I/O and PWR/GND pins with areally located I/O and PWR/GND pins (BGA packaged) increases the complexity of the models, when power delivery issues need to be studied in a larger contest, such as the overall PCB's. The employment of the powerful, …
A Hybrid Approach To Decrease Port Influence In Transmission Line Characterization, Jianmin Zhang, David Pommerenke, James L. Drewniak, Richard E. Dubroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo
A Hybrid Approach To Decrease Port Influence In Transmission Line Characterization, Jianmin Zhang, David Pommerenke, James L. Drewniak, Richard E. Dubroff, Zhiping Yang, Wheling Cheng, John Fisher, Sergio Camerlo
Electrical and Computer Engineering Faculty Research & Creative Works
Characterization and models for multi-gigabit signaling is an important issue in modern digital system. A good physical based model relies on a precise characterization of the test board. Typically, the characterization of the test board is associated with scattering matrix parameter measurement, which can be done with a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The commonly used launch techniques on PCBs (Printed Circuit Boards) associated with the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The transition between …
Traces In Proximity To Gaps In Return Planes, Todd H. Hubing, Thomas Van Doren, Theodore M. Zeeff
Traces In Proximity To Gaps In Return Planes, Todd H. Hubing, Thomas Van Doren, Theodore M. Zeeff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known techniques. One such technique is to isolate circuitry in different areas of the printed circuit board by strategically placing a gap in the signal return plane. However, this technique is only effective at reducing common-impedance coupling, which is generally not a significant coupling mechanism at frequencies above 1 MHz. This paper investigates the effect of a gap located between and parallel to adjacent microstrip traces. The effect of the gap on the mutual inductance and mutual capacitance is evaluated. Laboratory measurements and numerical simulations show …