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Accelerated Aging Of Mwcnt Filled Electrically Conductive Adhesives, Ashwanth Reddy Vangala

University of Kentucky Master's Theses

Electrically conductive adhesives (ECA) are discussed and studied with everincreasing interest as an environmentally friendly alternative to solder interconnection in microelectronics circuit packaging. They are used to attach surface mount devices (SMD), Integrated Circuits (IC) and Flip chips in electronic assembly. The use of ECAs brings some benefits like flexibility, mild processing conditions and process simplicity. Multi walled carbon nanotubes (MWCNT) are used instead of metal fillers because of their novel properties such as light weight, high aspect ratio, corrosion resistant, reduced processing temperature, lead free, good electrical conduction and mechanical strength.

The purpose of the present work is to …