Open Access. Powered by Scholars. Published by Universities.®

Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Electrical and Computer Engineering

USF Tampa Graduate Theses and Dissertations

Theses/Dissertations

2014

Capacitive

Articles 1 - 2 of 2

Full-Text Articles in Engineering

Development Of Electroplated-Ni Structured Micromechanical Resonators For Rf Application, Mian Wei Sep 2014

Development Of Electroplated-Ni Structured Micromechanical Resonators For Rf Application, Mian Wei

USF Tampa Graduate Theses and Dissertations

On-chip vibrating MEMS resonators with high frequency-Q product on par with that of the off-chip quartz crystals have attracted lots of attention from both academia and industry for applications on sensing, signal processing, and wireless communication. Up to now, several approaches for monolithic integration of MEMS and transistors have been demonstrated. Vibrating micromechanical disk resonators which utilize electroplated nickel as the structural material along with either a solid-gap high-k dielectric capacitive transducer or a piezoelectric transducer have great potential to offer unprecedented performance and capability of seamless integration with integrated circuits.

Despite the frequency drift problems encountered in early attempts …


Integrated Electrostatically- And Piezoelectrically-Transduced Contour-Mode Mems Resonator On Silicon-On-Insulator (Soi) Wafer, I-Tsang Wu Jun 2014

Integrated Electrostatically- And Piezoelectrically-Transduced Contour-Mode Mems Resonator On Silicon-On-Insulator (Soi) Wafer, I-Tsang Wu

USF Tampa Graduate Theses and Dissertations

Due to the recent rapid growth in personal mobile communication devices (smartphones, PDA's, tablets, etc.), the wireless market is always looking for new ways to further miniaturize the RF front-ends while reducing the cost and power consumption. For many years, wireless transceivers and subsystems have been relying on high quality factor (Q) passives (e.g., quartz crystal, ceramics) to implement oscillators, filters, and other key RF front-end circuitry elements. However, these off-chip discrete components occupy large chip area and require power-demanding interfacing circuits. As a result, a great deal of research effort has been devoted to the development of …