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Eliminating Via-Plane Coupling Using Ground Vias For High-Speed Signal Transitions, Songping Wu, Xin Chang, Christian Schuster, Xiaoxiong Gu, Jun Fan
Eliminating Via-Plane Coupling Using Ground Vias For High-Speed Signal Transitions, Songping Wu, Xin Chang, Christian Schuster, Xiaoxiong Gu, Jun Fan
Electrical and Computer Engineering Faculty Research & Creative Works
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.