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Electrical and Computer Engineering

Electrical and Computer Engineering Faculty Research & Creative Works

2004

Printed Circuits

Articles 1 - 3 of 3

Full-Text Articles in Engineering

A Time Domain Approach To Estimate Current Draw From Smt Decoupling Capacitors, Lin Zhang, Bruce Archambeault, Samuel Conner, James L. Knighten, Jun Fan, Norman W. Smith, Ray Alexander, Richard E. Dubroff, James L. Drewniak Aug 2004

A Time Domain Approach To Estimate Current Draw From Smt Decoupling Capacitors, Lin Zhang, Bruce Archambeault, Samuel Conner, James L. Knighten, Jun Fan, Norman W. Smith, Ray Alexander, Richard E. Dubroff, James L. Drewniak

Electrical and Computer Engineering Faculty Research & Creative Works

A time domain approach to investigate and predict impedances and scattering parameters of a DC power bus is proposed. This approach is based on a cavity model and is achieved using a circuit simulation tool - SPICE. A SPICE-based circuit model for triangular power plane segments is described, verified and applied to simulate both the frequency and time domain characteristics of an irregularly shaped two-layer PCB board. Furthermore, the current draw from a surface mount technology (SMT) decoupling capacitor is simulated and estimated using this approach. Near-field electromagnetic loop probes are used to validate the current estimation qualitatively. Additionally the …


Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen Jan 2004

Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen

Electrical and Computer Engineering Faculty Research & Creative Works

An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.


Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu Jan 2004

Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu

Electrical and Computer Engineering Faculty Research & Creative Works

Previous studies have demonstrated that power plane pairs in a printed circuit board are capable of generating significant radiated emissions at resonance frequencies if these resonances are not damped by material or component losses. The paper shows that board resonances may be readily damped by component losses. However, radiated emissions from a damped power bus may still exceed FCC or CISPR limits over a broad band of frequencies.