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Electrical and Computer Engineering

Electrical and Computer Engineering Faculty Research & Creative Works

2004

EMC

Articles 1 - 5 of 5

Full-Text Articles in Engineering

Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires Aug 2004

Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires

Electrical and Computer Engineering Faculty Research & Creative Works

Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.


Comparison Of Via Equivalent Circuit Model Accuracy Using Quasi-Static And Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, Albert E. Ruehli Aug 2004

Comparison Of Via Equivalent Circuit Model Accuracy Using Quasi-Static And Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, Albert E. Ruehli

Electrical and Computer Engineering Faculty Research & Creative Works

The EMC and signal integrity impact of printed circuit board (PCB) trace discontinuities, such as vias, where the signal is transitioned from one layer to another in the PCB stackup, have become significant recently with the use of very high speed signals in today''s systems. If these discontinuities are ignored, significant distortion of the high speed signal can occur, and in many cases, cause data errors. A fast and accurate technique to include the effect of via discontinuities in the typical design process is needed to ensure this distortion is considered if significant. Therefore, a simple equivalent circuit for the …


Mas-Mom Hybrid Method With Wire's Image Using In Excitation Problems, D. G. Kakulia, David Pommerenke, Kai Xiao, D. D. Karkashadze, K. N. Tavzarashvili, G. N. Ghvedashvili, R. S. Zaridze Jan 2004

Mas-Mom Hybrid Method With Wire's Image Using In Excitation Problems, D. G. Kakulia, David Pommerenke, Kai Xiao, D. D. Karkashadze, K. N. Tavzarashvili, G. N. Ghvedashvili, R. S. Zaridze

Electrical and Computer Engineering Faculty Research & Creative Works

An important class of problems is the interaction of an antenna with the cavity of a semi-open metallic structure. In a working environment, an antenna may change its performance due to interactions with its surroundings. This is especially true in automotive applications. Therefore, it is important to consider the interaction of an antenna with possible resonating parts, and to solve these complex electrodynamics problems together. The development of methods for modeling and studying electromagnetic compatibility (EMC) problems has practical value. The method of auxiliary sources (MAS) with the method of moments (MoM) is applied to solve the excitation problem where …


Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen Jan 2004

Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen

Electrical and Computer Engineering Faculty Research & Creative Works

An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.


Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu Jan 2004

Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu

Electrical and Computer Engineering Faculty Research & Creative Works

Previous studies have demonstrated that power plane pairs in a printed circuit board are capable of generating significant radiated emissions at resonance frequencies if these resonances are not damped by material or component losses. The paper shows that board resonances may be readily damped by component losses. However, radiated emissions from a damped power bus may still exceed FCC or CISPR limits over a broad band of frequencies.