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Electrical and Computer Engineering
Electrical and Computer Engineering Faculty Research & Creative Works
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Full-Text Articles in Engineering
Dc Power Bus Modeling Using A Circuit Extraction Approach Based On A Mixed-Potential Integral Equation Formulation And An Iterative Equation Solver, Jun Fan, James L. Drewniak, James L. Knighten
Dc Power Bus Modeling Using A Circuit Extraction Approach Based On A Mixed-Potential Integral Equation Formulation And An Iterative Equation Solver, Jun Fan, James L. Drewniak, James L. Knighten
Electrical and Computer Engineering Faculty Research & Creative Works
A quick and simple approach is developed to perform circuit simulations for an equivalent circuit extracted from a first principles formulation for DC power bus structures. The simulations are done by solving the system equation using an iterative method. Good agreement between modeling and measurements demonstrate the effectiveness of the method, which is very suitable and computationally efficient for frequency-domain DC power modeling.
Emc Analysis Of An 18" Lcd Monitor, Theodore M. Zeeff, Todd H. Hubing, James L. Drewniak, Richard E. Dubroff, Thomas Van Doren
Emc Analysis Of An 18" Lcd Monitor, Theodore M. Zeeff, Todd H. Hubing, James L. Drewniak, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
This paper describes a case study covering the evaluation and reduction of the radiated EMI from an 18 inches Liquid Crystal Display (LCD) monitor. The evaluation was completed in two parts: first potential EMI sources at the Printed Circuit Board (PCB) level were identified, then the EMI antennas driven by these sources were analyzed. Methods for reducing the EMI were described in detail, and where applicable, those modifications were applied. Radiated measurements demonstrate the effectiveness of these recommendations.
The Emi Benefits Of Ground Plane Stitching In Multi-Layer Power Bus Stacks, Xiaoning Ye, David M. Hockanson, Min Li, Wei Cui, S. Radu, James L. Drewniak, Thomas Van Doren, Todd H. Hubing, Richard E. Dubroff
The Emi Benefits Of Ground Plane Stitching In Multi-Layer Power Bus Stacks, Xiaoning Ye, David M. Hockanson, Min Li, Wei Cui, S. Radu, James L. Drewniak, Thomas Van Doren, Todd H. Hubing, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
The effect on EMI of stitching multiple ground planes together along the periphery of multi-layer PCB stacks is studied. Power bus noise induced EMI and radiation from the board edges is the major concern herein. The EMI at 3 meters for different via stitch spacing and layer thickness is modeled with FDTD modeling. It is shown that the ground plane stitching effectively reduces the radiated EMI that results from fringing fields at the power bus edges. Two families of curves are generated to demonstrate the variation of the radiated EMI as a function of layer thickness and stitch spacing. Further …
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, …