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An Experimental Investigation Of 4-Layer Printed Circuit Board Decoupling, Todd H. Hubing, Thomas Van Doren, Fei Sha, James L. Drewniak, Michael J. Wilhelm
An Experimental Investigation Of 4-Layer Printed Circuit Board Decoupling, Todd H. Hubing, Thomas Van Doren, Fei Sha, James L. Drewniak, Michael J. Wilhelm
Electrical and Computer Engineering Faculty Research & Creative Works
This paper examines the measured power bus impedance of fully populated 4-layer printed circuit boards with internal power and ground planes. Three boards provided by two leading computer companies were evaluated. Each of the state-of-the-art high-speed boards used in this study employed surface-mount decoupling capacitors to reduce noise on the power bus. The boards were measured with and without some or all of their decoupling capacitance. The effectiveness of the decoupling capacitors as a function of location and frequency and the relationship between board impedance and power bus noise was explored. The behavior of 4-layer boards is shown to be …
Power Bus Decoupling On Multilayer Printed Circuit Boards, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Power Bus Decoupling On Multilayer Printed Circuit Boards, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus.