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Electromagnetic Emissions From The Ic Packaging, Nick K.H. Huang, Li (Lijun) Jun Jiang, Huichun Yu, Gang Li, Shuai Xu, Tao Wang, Huasheng Ren
Electromagnetic Emissions From The Ic Packaging, Nick K.H. Huang, Li (Lijun) Jun Jiang, Huichun Yu, Gang Li, Shuai Xu, Tao Wang, Huasheng Ren
Electrical and Computer Engineering Faculty Research & Creative Works
The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results. © 2012 IEEE.
Fundamental Components Of The Ic Packaging Electromagnetic Interference (Emi) Analysis, Nick K.H. Huang, Li (Lijun) Jun Jiang, Huichun Yu, Gang Li, Shuai Xu, Huasheng Ren
Fundamental Components Of The Ic Packaging Electromagnetic Interference (Emi) Analysis, Nick K.H. Huang, Li (Lijun) Jun Jiang, Huichun Yu, Gang Li, Shuai Xu, Huasheng Ren
Electrical and Computer Engineering Faculty Research & Creative Works
The IC packaging EMC/SI/PI problems have been broadly attested. But IC packaging EMI was seldom addressed. Because the EMI emission by IC packagings is increasingly significant, in this paper, EMI behaviors are systematically studied. To fundamentally understand the radiation mechanism, radiated contributions from ground lids, vias, and traces of the packaging are investigated and modeled separately. It is seen that the packaging EMI has clearly low frequency and high frequency behaviors. The low frequency behavior is due to the Hertzian dipole effects of vias. The high frequency behavior is due to the radiation of excited cavity modes. Both theoretical analysis …