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Experimental Evaluation Of Power Bus Decoupling On A 4-Layer Printed Circuit Board, Juan Chen, Minjia Xu, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Experimental Evaluation Of Power Bus Decoupling On A 4-Layer Printed Circuit Board, Juan Chen, Minjia Xu, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
The switching of active devices on printed circuit boards (PCBs) can cause a momentary surge or drop in the power bus voltage. Decoupling capacitors are often utilized to alleviate this problem. They help to stabilize the power bus voltage by supplying transient current to active devices. The decoupling strategy, including where to place the high-frequency decoupling capacitors, is often a topic of debate. This paper examines the effect of decoupling capacitor placement on a 4-layer printed circuit board. Some design guidelines are provided.
Quantifying Decoupling Capacitor Location, Jun Fan, James L. Knighten, Antonio Orlandi, Norman W. Smith, James L. Drewniak
Quantifying Decoupling Capacitor Location, Jun Fan, James L. Knighten, Antonio Orlandi, Norman W. Smith, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Decoupling capacitor location in DC power bus design is a critical design choice for which proven guidelines are not well established. The mutual inductance between two closely spaced vias can have a great impact on the coupling between an IC and a decoupling capacitor. This coupling is a function of the spacing between the IC and capacitor, and spacing between power and ground layers. The impact of the mutual inductance on decoupling, i.e., local versus global decoupling, was studied, using a circuit extraction approach based on a mixed-potential integral equation. Modeling indicates that local decoupling has benefits over global decoupling …
Experimental And Numerical Study Of The Radiation From Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Experimental And Numerical Study Of The Radiation From Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
This paper investigates the radiation from microstrip lines with 90-degree bends. A 1-GHz TEM cell is used to measure the radiation from microstrip lines with different kinds of bends. A full wave hybrid FEM/MoM code is used to compute the radiation. Both experimental and numerical results show that there is no significant difference between the radiation from right angle bends and bends with two 45-degree corners at frequencies and trace dimensions that are likely to be found on printed circuit boards.
Fdtd And Fem/Mom Modeling Of Emi Resulting From A Trace Near A Pcb Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Fdtd And Fem/Mom Modeling Of Emi Resulting From A Trace Near A Pcb Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.