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Dc Power Bus Design With Fdtd Modeling Including A Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, James L. Drewniak
Dc Power Bus Design With Fdtd Modeling Including A Dispersive Media, Xiaoning Ye, Jun Fan, Marina Koledintseva, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
DC power-bus modeling in high-speed digital design using the FDTD method is reported here. The dispersive medium is approximated by a Debye model to account for the loss. A wide band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Favorable agreement is achieved between the modeled and measured results for a typical DC power-bus structure with multiple SMT decoupling capacitors mounted on the board. The FDTD tool is then applied to investigate the effects of local decoupling on a DC power-bus. The modeled results agree with the results from another modeling tool, the CEMPIE (a circuit …
Experimental And Fdtd Study Of The Emi Performance Of An Open-Pin-Field Connector For Modules-On-Backplanes, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Richard E. Dubroff, Thomas Van Doren, Todd H. Hubing
Experimental And Fdtd Study Of The Emi Performance Of An Open-Pin-Field Connector For Modules-On-Backplanes, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Richard E. Dubroff, Thomas Van Doren, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Experimental measurements and numerical modeling were used to study the EMI performance of a module-on-backplane connector for various configurations of signal-return pin-outs. A commercially available open-pin-field connector was used in these results to connect between the mother-board and the daughter-card. The experimental techniques, based on measuring |S21|, included both common-mode current measurements and monopole near-field probe measurements. The FDTD method was used to provide numerical support of the near-field measurements and generally agreed with the measured results for frequencies up to 3 GHz. The FDTD method was also used to investigate the relationship between the radiated EMI at …
Emi From Airflow Aperture Arrays In Shielding Enclosures-Experiments, Fdtd, And Mom Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren
Emi From Airflow Aperture Arrays In Shielding Enclosures-Experiments, Fdtd, And Mom Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Aperture arrays designed to provide airflow through shielding enclosures can provide part of the coupling path from interior sources to external electromagnetic interference (EMI). In this work, radiation through aperture arrays is investigated numerically and experimentally. FDTD modeling is compared with measurements on aperture arrays in a test enclosure. The method of moments (MoM) is also utilized to study radiation from apertures and to investigate the mutual coupling between apertures in an infinite conducting plane. A simple design equation for the relation between aperture size and number and shielding effectiveness is proposed.
Fdtd And Fem/Mom Modeling Of Emi Resulting From A Trace Near A Pcb Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Fdtd And Fem/Mom Modeling Of Emi Resulting From A Trace Near A Pcb Edge, Daniel P. Berg, Motoshi Tanaka, Yun Ji, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.
The Emi Benefits Of Ground Plane Stitching In Multi-Layer Power Bus Stacks, Xiaoning Ye, David M. Hockanson, Min Li, Wei Cui, S. Radu, James L. Drewniak, Thomas Van Doren, Todd H. Hubing, Richard E. Dubroff
The Emi Benefits Of Ground Plane Stitching In Multi-Layer Power Bus Stacks, Xiaoning Ye, David M. Hockanson, Min Li, Wei Cui, S. Radu, James L. Drewniak, Thomas Van Doren, Todd H. Hubing, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
The effect on EMI of stitching multiple ground planes together along the periphery of multi-layer PCB stacks is studied. Power bus noise induced EMI and radiation from the board edges is the major concern herein. The EMI at 3 meters for different via stitch spacing and layer thickness is modeled with FDTD modeling. It is shown that the ground plane stitching effectively reduces the radiated EMI that results from fringing fields at the power bus edges. Two families of curves are generated to demonstrate the variation of the radiated EMI as a function of layer thickness and stitch spacing. Further …
Fdtd Modeling Of Lumped Ferrites, Min Li, Xiao Luo, James L. Drewniak
Fdtd Modeling Of Lumped Ferrites, Min Li, Xiao Luo, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Implementing ferrites in finite-difference time-domain (FDTD) modeling requires special care because of the complex nature of the ferrite impedance. Considerable computational resources and time are required to directly implement a ferrite in the FDTD method. Fitting the ferrite impedance to an exponential series with the generalized-pencil-of-function (GPOF) method and using recursive convolution is an approach that minimizes the additional computational burden. An FDTD algorithm for a lumped ferrite using GPOF and recursive convolution is presented herein. Two different ferrite impedances in a test enclosure were studied experimentally to demonstrate the FDTD modeling approach. The agreement is generally good.
Emi Reduction From Airflow Aperture Arrays Using Dual-Perforated Screens And Loss, Min Li, Joe Nuebel, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Emi Reduction From Airflow Aperture Arrays Using Dual-Perforated Screens And Loss, Min Li, Joe Nuebel, James L. Drewniak, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Airflow perforations in shielding enclosures can act as apertures facilitating the coupling from internal sources to external electromagnetic interference (EMI). This EMI radiation for single- and dual-screen configurations was studied herein experimentally and with finite-difference time-domain (FDTD) modeling. A general EMI reduction of more than 20 dB was achieved for dual-perforated screens spaced 1 cm apart when compared to EMI for a single perforated screen. However, in the dual-screen case, the space between the screens can act as a thin cavity, which, in turn, can lead to significant radiation at distinct angles. Damping the resonances by loading the space between …
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, …