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Transfer Printed Semiconductor Nanomembranes For Heterogeneously Integrated Multi-Band Imager Arrays, Laxmy Menon

Electrical Engineering Dissertations

The electronics industry is ruled by silicon which is realized as the solution to meet the requirements of higher bandwidth and low cost high density monolithic integration. However, silicon has its limitations when it comes to high frequency or optoelectronic applications. Fusion of several functionalities on one chip can be obtained by heterogeneous integration of materials that have optimized performance for a specific application. The ability to tailor heterogeneous materials to be able to integrate them with each other, in rigid or flexible form, can lead to novel and superior functionalities, with impact in multitude of areas like electronics, optoelectronics, …