Open Access. Powered by Scholars. Published by Universities.®
Electrical and Computer Engineering
Mechanical and Materials Engineering Faculty Publications and Presentations
Articles 1 - 1 of 1
Full-Text Articles in Engineering
Flip-Chip (Fc) And Fine-Pitch-Ball-Grid-Array (Fpbga) Underfills For Application In Aerospace Electronics—Brief Review, Ephraim Suhir, Reza Ghaffarian
Flip-Chip (Fc) And Fine-Pitch-Ball-Grid-Array (Fpbga) Underfills For Application In Aerospace Electronics—Brief Review, Ephraim Suhir, Reza Ghaffarian
Mechanical and Materials Engineering Faculty Publications and Presentations
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for which high reliability level is imperative. The following aspects of the FC and FPGGA technologies are considered: attributes of the FC and FPBGA structures and technologies; underfill-induced stresses; the roles of the glass transition temperature (Tg) of the underfill materials; some major attributes of the lead-free solder systems with underfill; reliability-related issues; thermal fatigue of the underfilled solder joints; warpage-related issues; attributes of accelerated life …