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Modeling Noise Coupling Between Package And Pcb Power/Ground Planes With An Efficient 2-D Fdtd/Lumped Element Method, Ting-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, James L. Drewniak, Tzong-Lin Wu
Modeling Noise Coupling Between Package And Pcb Power/Ground Planes With An Efficient 2-D Fdtd/Lumped Element Method, Ting-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, James L. Drewniak, Tzong-Lin Wu
Electrical and Computer Engineering Faculty Research & Creative Works
An efficient numerical approach based on the 2-D finite-difference time-domain (FDTD) method is proposed to model the power/ground plane noise or simultaneously switching noise (SSN), including the interconnect effect between the package and the print circuit board (PCB). The space between the power and ground planes on the package and PCB are meshed with 2-D cells. The equivalent R-L-C circuits of the via and the solder balls connecting the package and PCB can be incorporated into a 2-D Yee cell based on a novel integral formulation in the time domain. An efficient recursive updating algorithm is proposed to fit the …
Early Time Charge Replenishment Of The Power Delivery Network In Multi-Layer Pcbs, Giuseppe Selli, Matteo Cocchini, James L. Knighten, Bruce Archambeault, Jun Fan, Samuel R. Connor, Antonio Orlandi, James L. Drewniak
Early Time Charge Replenishment Of The Power Delivery Network In Multi-Layer Pcbs, Giuseppe Selli, Matteo Cocchini, James L. Knighten, Bruce Archambeault, Jun Fan, Samuel R. Connor, Antonio Orlandi, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
The investigation of decoupling issues has been extensively treated in the literature in both the frequency and the time domain [1-9]. The two domains describe from different perspectives the same physical phenomenon, being related by a Fourier transform. In this article, well known decoupling issues usually addressed in the frequency domain [1,2] are discussed in the time domain. Moreover, some modeling issues related to the cavity model approach are discussed and, in particular, the circuit extraction feature associated with this methodology is utilized throughout the article to carry out the time domain simulations within a SPICE based-tool. The depletion of …