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Engineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Electrical and Computer Engineering

Missouri University of Science and Technology

1998

Printed Circuits

Articles 1 - 3 of 3

Full-Text Articles in Engineering

Considerations For Magnetic-Field Coupling Resulting In Radiated Emi, David M. Hockanson, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren Aug 1998

Considerations For Magnetic-Field Coupling Resulting In Radiated Emi, David M. Hockanson, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren

Electrical and Computer Engineering Faculty Research & Creative Works

Parasitic inductance in printed circuit board geometries can worsen the EMI performance and signal integrity of high-speed digital designs. Partial-inductance theory is a powerful tool for analyzing inductance issues in signal integrity. However, partial inductances may not adequately model magnetic flux coupling to EMI antennas because the EMI antennas are typically open loops. Therefore, partial inductances may not always accurately predict radiated EMI from noise sources, unless used in a full-wave analysis such as PEEC. Partial inductances can be used, however, to estimate branch inductances, which can be used to predict EMI. This paper presents a method for decomposing loop …


An Impact Of Layer Stack-Up On Emi, S. Radu, Theodore M. Zeeff, Joe Nuebel, James L. Drewniak, Todd H. Hubing, Thomas Van Doren Aug 1998

An Impact Of Layer Stack-Up On Emi, S. Radu, Theodore M. Zeeff, Joe Nuebel, James L. Drewniak, Todd H. Hubing, Thomas Van Doren

Electrical and Computer Engineering Faculty Research & Creative Works

Investigation of a server shows the heatsink of the CPU module as a primary component of the EMI coupling path. In order to identify the specific noise source and coupling path to the heatsink, a series of experiments were defined to provide support for one source and eliminate others. Based on experiments with two different versions of the CPU module, a stack-up related design guideline is proposed: a ground layer should be the first entire plane (as opposed to Vcc) on the active component side of the board. If there are known IC sources that switch significant currents …


Emc Applications Of The Emap5 Hybrid Fem/Mom Code, Yun Ji, Todd H. Hubing, Mohammad Wares Ali Jan 1998

Emc Applications Of The Emap5 Hybrid Fem/Mom Code, Yun Ji, Todd H. Hubing, Mohammad Wares Ali

Electrical and Computer Engineering Faculty Research & Creative Works

EMAP5 is a numerical software package designed to model electromagnetic problems. It employs the finite element method (FEM) to analyze three-dimensional volumes, and the method of moments (MOM) to analyze the current distribution on the surface of these volumes. The two methods are coupled through the fields on the dielectric surface. This paper describes the formulation of the EMAP5 code and demonstrates how it can be used to analyze simple printed circuit board configurations