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Full-Text Articles in Engineering
Complex Power Distribution Network Investigation Using Spice Based Extraction From First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault, Stefano Grivet-Talocia, Flavio G. Canavero
Complex Power Distribution Network Investigation Using Spice Based Extraction From First Principle Formulations, Giuseppe Selli, James L. Drewniak, Richard E. Dubroff, Jun Fan, James L. Knighten, Norman W. Smith, Dean Mccoy, Bruce Archambeault, Stefano Grivet-Talocia, Flavio G. Canavero
Electrical and Computer Engineering Faculty Research & Creative Works
The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
Coupling Between Differential Signals And The Dc Power-Bus In Multilayer Pcbs, Chen Wang, Marco Leone, James L. Drewniak, Antonio Orlandi
Coupling Between Differential Signals And The Dc Power-Bus In Multilayer Pcbs, Chen Wang, Marco Leone, James L. Drewniak, Antonio Orlandi
Electrical and Computer Engineering Faculty Research & Creative Works
Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.
Derivation Of A Closed-Form Approximate Expression For The Self-Capacitance Of A Printed Circuit Board Trace, Todd H. Hubing, Hwan-Woo Shim
Derivation Of A Closed-Form Approximate Expression For The Self-Capacitance Of A Printed Circuit Board Trace, Todd H. Hubing, Hwan-Woo Shim
Electrical and Computer Engineering Faculty Research & Creative Works
The electric fields that couple traces on printed circuit boards to attached cables can generate common-mode currents that result in significant radiated emissions. Previous work has shown that these radiated emissions can be estimated based on the self-capacitances of the microstrip structures on a board . In general, the determination of these self-capacitances must be done numerically using three-dimensional static modeling software. In this paper, an approximate closed-form expression for the self-capacitance of microstrip traces is derived. This expression can be used to estimate the voltage-driven common-mode emissions from boards with various microstrip trace geometries. The expression also provides insight …
Model For Estimating Radiated Emissions From A Printed Circuit Board With Attached Cables Due To Voltage-Driven Sources, Todd H. Hubing, Hwan-Woo Shim
Model For Estimating Radiated Emissions From A Printed Circuit Board With Attached Cables Due To Voltage-Driven Sources, Todd H. Hubing, Hwan-Woo Shim
Electrical and Computer Engineering Faculty Research & Creative Works
Common-mode currents induced on cables attached to printed circuit boards (PCBs) can be a significant source of unintentional radiated emissions. This paper develops a model for estimating the amount of common-mode cable current that can be induced by the signal voltage on microstrip trace structures or heatsinks on a PCB. The model employs static electric field solvers or closed-form expressions to estimate the effective self-capacitances of the board, trace, and/or heatsink. These capacitances are then used to determine the amplitude of an equivalent common-mode voltage source that drives the attached cables. The model shows that these voltage-driven common-mode cable currents …
Traces In Proximity To Gaps In Return Planes, Todd H. Hubing, Thomas Van Doren, Theodore M. Zeeff
Traces In Proximity To Gaps In Return Planes, Todd H. Hubing, Thomas Van Doren, Theodore M. Zeeff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known techniques. One such technique is to isolate circuitry in different areas of the printed circuit board by strategically placing a gap in the signal return plane. However, this technique is only effective at reducing common-impedance coupling, which is generally not a significant coupling mechanism at frequencies above 1 MHz. This paper investigates the effect of a gap located between and parallel to adjacent microstrip traces. The effect of the gap on the mutual inductance and mutual capacitance is evaluated. Laboratory measurements and numerical simulations show …
Esd Susceptibility Characterization Of An Eut By Using 3d Esd Scanning System, Kai Wang, Jayong Koo, Giorgi Muchaidze, David Pommerenke
Esd Susceptibility Characterization Of An Eut By Using 3d Esd Scanning System, Kai Wang, Jayong Koo, Giorgi Muchaidze, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
Electrostatic discharges (ESD) can lead to soft-errors (e.g., bit-errors, wrong resets etc.) in digital electronics. The use of lower threshold voltages and faster I/O increases the sensitivity. In the analysis of ESD problems, an exact knowledge of the affected pins and nets is essential for an optimal solution. In this paper, a three dimensional ESD scanning system which has been developed to record the ESD susceptibility map for printed circuit board is presented and the mechanisms that the ESD event couples into the digital devices is studied. The ESD susceptibility of a fast CMOS EUT is characterized by generating the …
Analytical Model For The Rectangular Power-Ground Structure Including Radiation Loss, Ji Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Analytical Model For The Rectangular Power-Ground Structure Including Radiation Loss, Ji Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Electrical and Computer Engineering Faculty Research & Creative Works
An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered in this model. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss printed circuit boards. Measurements are performed to validate the effectiveness of this model.