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Electrical and Computer Engineering

Marquette University

Series

2016

Cantilever

Articles 1 - 2 of 2

Full-Text Articles in Engineering

Mems-Based Terahertz Photoacoustic Chemical Sensing System, Nathan Glauvitz, Ronald A. Coutu Jr., Ivan R. Medvedev, Douglas T. Petkie Aug 2016

Mems-Based Terahertz Photoacoustic Chemical Sensing System, Nathan Glauvitz, Ronald A. Coutu Jr., Ivan R. Medvedev, Douglas T. Petkie

Electrical and Computer Engineering Faculty Research and Publications

Advancements in microelectromechanical system (MEMS) technology over the last several decades has been a driving force behind miniaturizing and improving sensor designs. In this work, a specialized cantilever pressure sensor was designed, modeled, and fabricated to investigate the photoacoustic (PA) response of gases to terahertz (THz) radiation under low-vacuum conditions associated with high-resolution spectroscopy. Microfabricated cantilever devices made using silicon-on-insulator (SOI) wafers were tested in a custom-built test chamber in this first ever demonstration of a cantilever-based PA chemical sensor and spectroscopy system in the THz frequency regime. The THz radiation source was amplitude modulated to excite acoustic waves in …


Improved Sensitivity Mems Cantilever Sensor For Terahertz Photoacoustic Spectroscopy, Ronald A. Coutu Jr., Ivan R. Medvedev, Douglas T. Petkie Feb 2016

Improved Sensitivity Mems Cantilever Sensor For Terahertz Photoacoustic Spectroscopy, Ronald A. Coutu Jr., Ivan R. Medvedev, Douglas T. Petkie

Electrical and Computer Engineering Faculty Research and Publications

In this paper, a microelectromechanical system (MEMS) cantilever sensor was designed, modeled and fabricated to measure the terahertz (THz) radiation induced photoacoustic (PA) response of gases under low vacuum conditions. This work vastly improves cantilever sensitivity over previous efforts, by reducing internal beam stresses, minimizing out of plane beam curvature and optimizing beam damping. In addition, fabrication yield was improved by approximately 50% by filleting the cantilever’s anchor and free end to help reduce high stress areas that occurred during device fabrication and processing. All of the cantilever sensors were fabricated using silicon-on-insulator (SOI) wafers and tested in a custom …