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Electrical and Computer Engineering
Electrical and Computer Engineering Faculty Research and Publications
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Full-Text Articles in Engineering
Thermal Management Using Mems Bimorph Cantilever Beams, Ronald A. Coutu Jr., R. S. Lafleur, J. P.K. Walton, Lavern A. Starman
Thermal Management Using Mems Bimorph Cantilever Beams, Ronald A. Coutu Jr., R. S. Lafleur, J. P.K. Walton, Lavern A. Starman
Electrical and Computer Engineering Faculty Research and Publications
This paper examines a passive cooling technique using microelectromechanical systems (MEMS) for localized thermal management of electronic devices. The prototype was designed using analytic equations, simulated using finite element methods (FEM), and fabricated using the commercial PolyMUMPs™ process. The system consisted of an electronic device simulator (EDS) and MEMS bimorph cantilever beams (MBCB) array with beams lengths of 200, 250, and 300 μm that were tested to characterize deflection and thermal behavior. The specific beam lengths were chosen to actuate in response to heating associated with the EDS (i.e. the longest beams actuated first corresponding to the hottest portion of …
Surface Feature Engineering Through Nanosphere Lithography, Tod V. Laurvick, Ronald A. Coutu Jr., James M. Sattler, Robert A. Lake
Surface Feature Engineering Through Nanosphere Lithography, Tod V. Laurvick, Ronald A. Coutu Jr., James M. Sattler, Robert A. Lake
Electrical and Computer Engineering Faculty Research and Publications
How surface geometries can be selectively manipulated through nanosphere lithography (NSL) is discussed. Self-assembled monolayers and multilayers of nanospheres have been studied for decades and have been applied to lithography for almost as long. When compared to the most modern, state-of-the-art techniques, NSL offers comparable feature resolution with many advantages over competing technologies. Several high-resolution alternatives require scan-based implementation (i.e., focused ion beams and e-beam lithography) while NSL is much more of a batch operation, allowing for full wafer or possibly even multiple wafer processing, potentially saving time and increasing throughput in a manufacturing environment. Additionally, NSL has continued to …