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Passive Cooling Analysis Of An Electronic Chipset Using Nanoparticles And Metal-Foam Composite Pcm: An Experimental Study, Faisal Hassan, Abid Hussain, Furqan Jamil, Adeel Arshad, Hafiz Muhammad Ali
Passive Cooling Analysis Of An Electronic Chipset Using Nanoparticles And Metal-Foam Composite Pcm: An Experimental Study, Faisal Hassan, Abid Hussain, Furqan Jamil, Adeel Arshad, Hafiz Muhammad Ali
Research outputs 2022 to 2026
Thermal management of electronic components is critical for long-term reliability and continuous operation, as the over-heating of electronic equipment leads to decrement in performance. The novelty of the current experimental study is to investigate the passive cooling of electronic equipment, by using nano-enriched phase change material (NEPCM) with copper foam having porosity of 97 %. The phase change material of PT-58 was used with graphene nanoplatelets (GNPs) and magnesium oxide (MgO) nanoparticles (NPs), having concentrations of 0.01 wt. % and 0.02 wt. %. Three power levels of 8 W, 16 W, and 24 W, with corresponding heating inputs of 0.77 …