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Full-Text Articles in Engineering
Fdtd Analysis Of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, James L. Drewniak
Fdtd Analysis Of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A Lorentzian model as the general case of a frequency-dependent behavior of a dispersive dielectric material is considered in this paper. Recursive convolution algorithms for the finite-difference time-domain (FDTD) technique for two cases of a Lorentzian medium, narrowband and wideband, depending on the ratio of a resonance line half-width at -3 dB and the resonance frequency of the material, are detailed. It is shown that a wideband Lorentzian model of a dielectric FR-4 used in printed circuit boards is more flexible and gives good agreement with experimental curves, and may be preferable as compared to a Debye model.
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained.
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.
Eye Pattern Evaluation In High-Speed Digital Systems Analysis By Using Mtl Modeling, Giulio Antonini, James L. Drewniak, Antonio Orlandi, Vittorio Ricchiuti
Eye Pattern Evaluation In High-Speed Digital Systems Analysis By Using Mtl Modeling, Giulio Antonini, James L. Drewniak, Antonio Orlandi, Vittorio Ricchiuti
Electrical and Computer Engineering Faculty Research & Creative Works
A method for simulating the eye pattern of high-speed digital signals propagated on printed circuit boards using multiconductor transmission-line modeling is proposed in this paper. The approach takes into account the frequency-dependent properties of the dielectric materials of the board and of the conductors. The validation is performed by comparing the modeling with measurements taken from the literature, and directly performed on test boards specially design for this study.
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are …
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Electrical and Computer Engineering Faculty Research & Creative Works
The finite-difference time-domain method is applied to the analysis of transmission lines on printed circuit boards. The lossy, dispersive behavior of the dielectric substrate is accurately accounted for by means of several algorithms whose accuracy is discussed and compared. Numerical results are validated by comparisons with measurements and an equivalent circuit of slot in the ground plane is proposed.
On The Interior Resonance Problem When Applying A Hybrid Fem/Mom Approach To Model Printed Circuit Boards, Yun Ji, Todd H. Hubing
On The Interior Resonance Problem When Applying A Hybrid Fem/Mom Approach To Model Printed Circuit Boards, Yun Ji, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
A hybrid finite element method/method of moments (FEM/MoM) technique is used to analyze a printed circuit board power bus structure where the source and observation points are in the near field. The FEM is used to model the lossy region between the planes of the board including the source. The MoM is used to model the region outside the planes and provide a radiation boundary condition to terminate the FEM mesh. Numerical results for a bridged power bus structure are compared with measurements. A nonphysical interior resonance of the electric field integral equation is observed. The problem can be avoided …
Power Bus Isolation Using Power Islands In Printed Circuit Boards, J. Chen, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Power Bus Isolation Using Power Islands In Printed Circuit Boards, J. Chen, Todd H. Hubing, Richard E. Dubroff, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Power islands are often employed in printed circuit board (PCB) designs to alleviate the problem of power bus noise coupling between circuits. Good isolation can be obtained over a wide frequency band due to the large series impedance provided by the gap between the power islands. However, power bus resonances may degrade the isolation at high frequencies. The amount of isolation also depends on the type of connection between power islands and the components on the board. This paper experimentally investigates the effectiveness of several power island structures up to 3.0 GHz
Decoupling Strategies For Printed Circuit Boards Without Power Planes, Todd H. Hubing, Hwan-Woo Shim, Theodore M. Zeeff
Decoupling Strategies For Printed Circuit Boards Without Power Planes, Todd H. Hubing, Hwan-Woo Shim, Theodore M. Zeeff
Electrical and Computer Engineering Faculty Research & Creative Works
Traditional decoupling capacitors connected between V/CC/ and GND traces can be relatively ineffective at frequencies above their self-resonant frequency. This paper evaluates decoupling capacitor mounting strategies on boards without power planes. Techniques for minimizing mutual inductance and improving decoupling at frequencies above resonance are investigated.
Estimating The Power Bus Impedance Of Printed Circuit Boards With Embedded Capacitance, Minjia Xu, Todd H. Hubing
Estimating The Power Bus Impedance Of Printed Circuit Boards With Embedded Capacitance, Minjia Xu, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between closely spaced power and return planes. This paper employs a simple cavity model to investigate the features affecting the power bus impedance of printed circuit boards with embedded capacitance.
Reducing Power Bus Impedance At Resonance With Lossy Components, Todd H. Hubing, Theodore M. Zeeff
Reducing Power Bus Impedance At Resonance With Lossy Components, Todd H. Hubing, Theodore M. Zeeff
Electrical and Computer Engineering Faculty Research & Creative Works
Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.