Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 4 of 4
Full-Text Articles in Engineering
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained.
External Parasitic Inductance In Microstrip And Stripline Geometries Of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David M. Hockanson
External Parasitic Inductance In Microstrip And Stripline Geometries Of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
An external parasitic ground (return) plane inductance, or a mutual inductance associated with fringing magnetic fields in planar transmission line structures, is the culprit of common-mode voltage (ground plane noise) that leads to parasitic radiation of the corresponding unintentional "antennas" in high-speed electronic equipment. Mutual inductance of this sort in microstrip and stripline structures is studied here using an analytical quasi- magnetostatic approach and FDTD modeling. Closed-form expressions for mutual inductance in symmetrical and asymmetrical microstrip and stripline structures are presented.
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Application Of Higher-Order Fem Elements To The Analysis Of Microstrip Structures, H. Wang, C. L. Guo, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.
Field Extraction From Near Field Scanning For A Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. Dubroff, James L. Drewniak, David Pommerenke, Todd H. Hubing
Field Extraction From Near Field Scanning For A Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. Dubroff, James L. Drewniak, David Pommerenke, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Currents associated with high-speed digital devices have significant impacts on EMI problems in VLSI design and operation. In this paper, a simple transmission line model was implemented as an initial step to represent the EMI mechanisms associated with an IC package. Numerical modeling results were compared with near field scanning measurements and show that the magnetic field deduced from the measurements agrees well with the numerical predictions.