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Full-Text Articles in Engineering
Fdtd Analysis Of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, James L. Drewniak
Fdtd Analysis Of Printed Circuit Boards Containing Wideband Lorentzian Dielectric Dispersive Media, Marina Koledintseva, David Pommerenke, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A Lorentzian model as the general case of a frequency-dependent behavior of a dispersive dielectric material is considered in this paper. Recursive convolution algorithms for the finite-difference time-domain (FDTD) technique for two cases of a Lorentzian medium, narrowband and wideband, depending on the ratio of a resonance line half-width at -3 dB and the resonance frequency of the material, are detailed. It is shown that a wideband Lorentzian model of a dielectric FR-4 used in printed circuit boards is more flexible and gives good agreement with experimental curves, and may be preferable as compared to a Debye model.
External Parasitic Inductance In Microstrip And Stripline Geometries Of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David M. Hockanson
External Parasitic Inductance In Microstrip And Stripline Geometries Of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
An external parasitic ground (return) plane inductance, or a mutual inductance associated with fringing magnetic fields in planar transmission line structures, is the culprit of common-mode voltage (ground plane noise) that leads to parasitic radiation of the corresponding unintentional "antennas" in high-speed electronic equipment. Mutual inductance of this sort in microstrip and stripline structures is studied here using an analytical quasi- magnetostatic approach and FDTD modeling. Closed-form expressions for mutual inductance in symmetrical and asymmetrical microstrip and stripline structures are presented.
Numerical Modeling Of Esd-Simulators, Kai Wang, David Pommerenke, Ramachandran Chundru
Numerical Modeling Of Esd-Simulators, Kai Wang, David Pommerenke, Ramachandran Chundru
Electrical and Computer Engineering Faculty Research & Creative Works
ESD generators are widely used for testing the robustness of electronic equipment against human electrostatic discharge via small metal pieces (e.g. key). Presently the IEC 61000-4-2 ESD standard is hotly discussed to improve test result reproducibility. This paper numerically analyzes an ESD simulator and relates its construction parameters to discharge current and field parameters. It uses FDTD method and models the relay (contact mode discharge) as a material with time dependent conductivity. The process is broken down into a charging phase and a stabilization phase until the electrostatic conditions are reached. Then the conductivity of the relay is changed and …
Anticipating Full Vehicle Radiated Emi From Module-Level Testing In Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, James L. Drewniak
Anticipating Full Vehicle Radiated Emi From Module-Level Testing In Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
EMI due to common-mode currents on cables routed in automobiles was studied using a test device designed to mimic a vehicle. Both experimental work and Finite-Difference Time-Domain (FDTD) modeling were employed in this paper. The good agreement between the measurements and modeling results indicates that the numerical tools can be a useful aid in predicting vehicle-level EMI by developing vehicle transfer functions and measuring the module-level EMI characteristics on the bench top.
Fdtd Modeling Of Skin Effect, Chen Wang, James L. Drewniak, Min Li, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Jingyu Huang
Fdtd Modeling Of Skin Effect, Chen Wang, James L. Drewniak, Min Li, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Jingyu Huang
Electrical and Computer Engineering Faculty Research & Creative Works
The data rates and clock speeds of current highspeed signals are increasing rapidly, consequently, not only the lossy nature of FR-4 but also the lossy nature of good conductors, such as copper, need to be taken into account in high-speed signal designs. In order to well predict the loss caused by both dielectric loss and skin effect loss, a suitable simulation tool is needed. A surface impedance boundary condition (SIBC) algorithm was implemented in FDTD modeling herein to accommodate the skin effect loss due to finite conductivity of good conductors. Good agreement between the FDTD result and the measurements as …
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Electrical and Computer Engineering Faculty Research & Creative Works
The finite-difference time-domain method is applied to the analysis of transmission lines on printed circuit boards. The lossy, dispersive behavior of the dielectric substrate is accurately accounted for by means of several algorithms whose accuracy is discussed and compared. Numerical results are validated by comparisons with measurements and an equivalent circuit of slot in the ground plane is proposed.
High-Performance Inter-Pcb Connectors: Analysis Of Emi Characteristics, Xiaoning Ye, James L. Drewniak, Jim Nadolny, David M. Hockanson
High-Performance Inter-Pcb Connectors: Analysis Of Emi Characteristics, Xiaoning Ye, James L. Drewniak, Jim Nadolny, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S21| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good …