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Full-Text Articles in Engineering
Transmission Line Modeling Of Vias In Differential Signals, Chen Wang, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander
Transmission Line Modeling Of Vias In Differential Signals, Chen Wang, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander
Electrical and Computer Engineering Faculty Research & Creative Works
Signal layer transitions in differential lines are modeled using both FDTD and equivalent circuit methods. The equivalent circuit is developed based on transmission-line reasoning regarding via behavior. Parameters of each transmission-line segment are obtained based on its corresponding physical geometry. The mixed-mode S-parameters from the equivalent circuit and the FDTD modeling are compared. Good agreement is demonstrated in the frequency range from 1 GHz to 20 GHz. The results indicate that vias in differential lines can be modeled as a transmission line for a quick and easy engineering estimation of the differential signal behavior in an environment of signal layer …
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Extracting Cad Models For Quantifying Noise Coupling Between Vias In Pcb Layouts, Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, James L. Knighten, Norman W. Smith, Ray Alexander, Jim Nadolny, Yoshio Kami, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are …
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Efficient Modeling Of Discontinuities And Dispersive Media In Printed Transmission Lines, R. Araneo, Chen Wang, Xiaoxiong Gu, James L. Drewniak, S. Celozzi
Electrical and Computer Engineering Faculty Research & Creative Works
The finite-difference time-domain method is applied to the analysis of transmission lines on printed circuit boards. The lossy, dispersive behavior of the dielectric substrate is accurately accounted for by means of several algorithms whose accuracy is discussed and compared. Numerical results are validated by comparisons with measurements and an equivalent circuit of slot in the ground plane is proposed.
Esd Currents And Fields On The Vcp And The Hcp Modeled Using Quasi-Static Approximations, David Pommerenke, Wang Kai, Thomas Van Doren
Esd Currents And Fields On The Vcp And The Hcp Modeled Using Quasi-Static Approximations, David Pommerenke, Wang Kai, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
The horizontal coupling plane (HCP) and the vertical coupling plane (VCP) are essential elements of the standardized electrostatic discharge (ESD) test. They are used for testing the robustness of equipment against indirect (nearby) discharges. This article analyzed the current and the fields on the HCP and the VCP using plane wave, transmission line, quasi-static theory. The objective is to illustrate the dominating physical processes on these planes. The work is based on measurements of the transient currents and fields using broadband sensors.
Estimating The Power Bus Impedance Of Printed Circuit Boards With Embedded Capacitance, Minjia Xu, Todd H. Hubing
Estimating The Power Bus Impedance Of Printed Circuit Boards With Embedded Capacitance, Minjia Xu, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by enhancing the natural capacitance between closely spaced power and return planes. This paper employs a simple cavity model to investigate the features affecting the power bus impedance of printed circuit boards with embedded capacitance.