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Full-Text Articles in Engineering
Estimating Dc Power Bus Noise, Jingkun Mao, Bruce Archambeault, James L. Drewniak, Thomas Van Doren
Estimating Dc Power Bus Noise, Jingkun Mao, Bruce Archambeault, James L. Drewniak, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noise, as well as radiation problems. An approach for estimating the power bus noise spectrum is presented in this paper. The power bus noise caused by digital circuits injecting high-frequency noise onto the DC buses feeding digital devices is calculated. The transient current drawn by an IC device is modeled using the load current and the shoot-through current through the power dissipation capacitance. Modeling and experimental results for several digital chips are shown. The modeling agrees well with the experimental results.
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Modeling Noise Coupling From Non-Parallel Pcb Trace Routing, Shaofeng Luan, Fengchao Xiao, W. Liu, Jun Fan, Yoshio Kami, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained.
External Parasitic Inductance In Microstrip And Stripline Geometries Of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David M. Hockanson
External Parasitic Inductance In Microstrip And Stripline Geometries Of Finite Size, Marina Koledintseva, James L. Drewniak, Thomas Van Doren, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
An external parasitic ground (return) plane inductance, or a mutual inductance associated with fringing magnetic fields in planar transmission line structures, is the culprit of common-mode voltage (ground plane noise) that leads to parasitic radiation of the corresponding unintentional "antennas" in high-speed electronic equipment. Mutual inductance of this sort in microstrip and stripline structures is studied here using an analytical quasi- magnetostatic approach and FDTD modeling. Closed-form expressions for mutual inductance in symmetrical and asymmetrical microstrip and stripline structures are presented.
Anticipating Full Vehicle Radiated Emi From Module-Level Testing In Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, James L. Drewniak
Anticipating Full Vehicle Radiated Emi From Module-Level Testing In Automobiles, Geping Liu, Chingchi Chen, Yuhua Tu, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
EMI due to common-mode currents on cables routed in automobiles was studied using a test device designed to mimic a vehicle. Both experimental work and Finite-Difference Time-Domain (FDTD) modeling were employed in this paper. The good agreement between the measurements and modeling results indicates that the numerical tools can be a useful aid in predicting vehicle-level EMI by developing vehicle transfer functions and measuring the module-level EMI characteristics on the bench top.
Field Extraction From Near Field Scanning For A Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. Dubroff, James L. Drewniak, David Pommerenke, Todd H. Hubing
Field Extraction From Near Field Scanning For A Microstrip Structure, Lin Zhang, Kevin P. Slattery, Chen Wang, Masahiro Yamaguchi, K.-I. Arai, Richard E. Dubroff, James L. Drewniak, David Pommerenke, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Currents associated with high-speed digital devices have significant impacts on EMI problems in VLSI design and operation. In this paper, a simple transmission line model was implemented as an initial step to represent the EMI mechanisms associated with an IC package. Numerical modeling results were compared with near field scanning measurements and show that the magnetic field deduced from the measurements agrees well with the numerical predictions.
Estimating The Noise Mitigation Effect Of Local Decoupling In Printed Circuit Boards, Jun Fan, Wei Cui, James L. Drewniak, Thomas Van Doren, James L. Knighten
Estimating The Noise Mitigation Effect Of Local Decoupling In Printed Circuit Boards, Jun Fan, Wei Cui, James L. Drewniak, Thomas Van Doren, James L. Knighten
Electrical and Computer Engineering Faculty Research & Creative Works
Local decoupling, i.e., placing decoupling capacitors sufficiently close to device power/ground pins in order to decrease the impedance of power bus at frequencies higher than the series resonant frequency, has been studied using a modeling approach, a hybrid lumped/distributed circuit model established and an expression to quantify the benefits of power bus noise mitigation due to local decoupling developed. In this work, a test board with a local decoupling capacitor was studied and the noise mitigation effect due to the capacitor placed adjacent to an input test port was measured. Closed-form expressions for self and mutual inductances of vias are …
High-Performance Inter-Pcb Connectors: Analysis Of Emi Characteristics, Xiaoning Ye, James L. Drewniak, Jim Nadolny, David M. Hockanson
High-Performance Inter-Pcb Connectors: Analysis Of Emi Characteristics, Xiaoning Ye, James L. Drewniak, Jim Nadolny, David M. Hockanson
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S21| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good …
Fdtd Modeling Incorporating A Two-Port Network For I/O Line Emi Filtering Design, Xiaoning Ye, James L. Drewniak
Fdtd Modeling Incorporating A Two-Port Network For I/O Line Emi Filtering Design, Xiaoning Ye, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) filters are often utilized on I/O lines to reduce high-frequency noise form being conducted off the printed circuit board (PCB) and causing EMI problems. The filtering performance is often compromised at high frequencies due to parasitics associated with the filter itself, or the PCB layout and interconnects. Finite difference time domain (FDTD) modeling can be used to quantify the effect of PCB layout and interconnects, as well as filter type, on the EMI performance of I/O line filtering. FDTD modeling of a T-type and π-type filter consisting of surface-mount ferrites and capacitors is considered herein. The FDTD …
An Expert System Architecture To Detect System-Level Automotive Emc Problems, Sreeniwas Ranganathan, Daryl G. Beetner, R. Wiese, Todd H. Hubing
An Expert System Architecture To Detect System-Level Automotive Emc Problems, Sreeniwas Ranganathan, Daryl G. Beetner, R. Wiese, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Improving EMC in automobiles requires methods to detect potential problems early in the design process. Issues involved in the development of a system-level automotive EMC expert system are explored. The proposed system would help identify problems with radiation and immunity, crosstalk, placement of modules, component grounding and EMC testing. The architecture of the expert system has been developed. The system architecture is designed to allow rapid analysis of automobile designs, to point out potential problems and to suggest possible solutions.
Reducing Power Bus Impedance At Resonance With Lossy Components, Todd H. Hubing, Theodore M. Zeeff
Reducing Power Bus Impedance At Resonance With Lossy Components, Todd H. Hubing, Theodore M. Zeeff
Electrical and Computer Engineering Faculty Research & Creative Works
Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.