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Engineering Commons

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Electrical and Computer Engineering

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Florida Institute of Technology

1997

Hot-electron effect

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Full-Text Articles in Engineering

Stadium 501/Reliability Simulator For The Analysis Of Hot-Electron And Esd Induced Degradation In Non-Isothermal Device, Sungkwon Lee, Thomas J. Sanders Sep 1997

Stadium 501/Reliability Simulator For The Analysis Of Hot-Electron And Esd Induced Degradation In Non-Isothermal Device, Sungkwon Lee, Thomas J. Sanders

Electrical Engineering and Computer Science Faculty Publications

This paper addresses the integrated circuit industry needs for non-isothermal simulation in device reliability analysis, initial input factor sensitivity analysis and their software implementation. The key reliability issues are the hot-electron induced oxide damages and electro-static discharge (ESD) damages. The main purpose of this work is to provide a design aid tool to improve device reliability and performance. The reliability simulator developed in this work not only predicts designed device reliability, but also provides some information about the effect of manufacturing variations on reliability. This is accomplished by combining the statistical methodology with existing technology computer aided design (TCAD) tools. …