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Full-Text Articles in Engineering
Computational Studies Of Thermal Properties And Desalination Performance Of Low-Dimensional Materials, Yang Hong
Department of Chemistry: Dissertations, Theses, and Student Research
During the last 30 years, microelectronic devices have been continuously designed and developed with smaller size and yet more functionalities. Today, hundreds of millions of transistors and complementary metal-oxide-semiconductor cells can be designed and integrated on a single microchip through 3D packaging and chip stacking technology. A large amount of heat will be generated in a limited space during the operation of microchips. Moreover, there is a high possibility of hot spots due to non-uniform integrated circuit design patterns as some core parts of a microchip work harder than other memory parts. This issue becomes acute as stacked microchips get …
Three-Dimensional Scaffolds Of Graphene, Carbon Nanotubes And Transition-Metal Oxides For Applications In Electronics, Sensors And Energy Storage, Gilbert N. Mbah
Three-Dimensional Scaffolds Of Graphene, Carbon Nanotubes And Transition-Metal Oxides For Applications In Electronics, Sensors And Energy Storage, Gilbert N. Mbah
Department of Chemistry: Dissertations, Theses, and Student Research
Electronics, sensors and energy storage devices are the new waves behind economic development, security and communication1. Engineering small sizes of electronic, sensors and energy storage devices is the hurdle limiting efficient, portable and vast applications of Nano-devices for economic, security and communication advancement2. Silicon the major material used in transistors has approached its limit to fabricated Nano-devices3. The discovery of free standing, one atomic layer thick and two-dimensional graphene sheets with high conductivity, inert, high specific surface area, stable and high tensile strength material in 2004 has shown capabilities to replaced silicon in electronics, …