Physical Sciences and Mathematics Commons^™

A Multi-Chip Module Implementation Of A Neural Network, Tony R. Martinez, George L. Rudolph, Linton G. Salmon, Matthew G. Stout

Faculty Publications

The requirement for dense interconnect in artificial neural network systems has led researchers to seek high-density interconnect technologies. This paper reports an implementation using multi-chip modules (MCMs) as the interconnect medium. The specific system described is a self-organizing, parallel, and dynamic learning model which requires a dense interconnect technology for effective implementation; this requirement is fulfilled by exploiting MCM technology. The ideas presented in this paper regarding an MCM implementation of artificial neural networks are versatile and can be adapted to apply to other neural network and connectionist models.