Physical Sciences and Mathematics Commons^™

Design And Fabrication Of A Miniature Pressure Sensor Head Using Direct Bonded Ultra-Thin Silicon Wafers, Chad Eugene Statler

Theses

A miniature pressure sensor head is designed and fabricated using an ultra-thin silicon membrane directly bonded to an excimer laser micromachined substrate. The pressure sensor head has its intended implementation as part of an optically interrogated device with sensitivity to pressures ranging from 0.5 to 4.0 MPa. The pressure range design is shown to be easily adjusted by tailoring the thickness of the membrane wafer. The fabrication process features numerous advantages over existing pressure sensor construction technology including a maskless procedure and no chemical etching or mechanical thinning necessary to form the membrane after bonding. An optic lever is constructed …

Silicon Optical Fiber Pressure Sensor, Jian Pan

Theses

A novel optical fiber pressure sensor based on a micromachined thin silicon diaphragm is proposed. Detail descriptions of the sensor structure, modulation principle and fabrication process are given.

The device operates on the following principle: Pressure deflects a silicon diaphragm which moves the output end of a light source fiber. The emitted light intensity is picked up and shared by two receiving fibers placed side by side. The variation of the intensity ratio in the receiving fibers caused by the relative motion of the emitting fiber can be easily converted to a linear signal versus the deflection of the silicon …

A High Temperature Pressure Sensor Based On Magnetic Coupling And Silicon Wafer Bonding, Deguang Zhu

Theses

In this thesis, the design and fabrication of a bulk micromachined and wafer bonded pressure sensor for high temperature applications is described. The device design is based on the magnetic coupling principle as described by the Biot-Savart law. By combining the mechanical properties of single crystal silicon with magnetic coupling, the designed sensor can be operated up to 600°C. The key components within the sensor are two inductive coils, a silicon diaphragm and a hermetic vacuum cavity.

The modeling based on a nine-turn single level coil device and a 300 μm x 300 diaphragm indicates an output rms voltage range …