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Edge-Coupling Of O-Band Inp Etched-Facet Lasers To Polymer Waveguides On Soi By Micro-Transfer-Printing, Ruggero Loi, Steven Kelleher, Raja Fazan Gul, Antonio Jose Trindade, David Gomez, Liam O'Faolain, Brian Corbett, Simone Iadanza, Brendan Roycroft, James O'Callaghan, Lei Liu, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Alexander Farrell Feb 2020

Edge-Coupling Of O-Band Inp Etched-Facet Lasers To Polymer Waveguides On Soi By Micro-Transfer-Printing, Ruggero Loi, Steven Kelleher, Raja Fazan Gul, Antonio Jose Trindade, David Gomez, Liam O'Faolain, Brian Corbett, Simone Iadanza, Brendan Roycroft, James O'Callaghan, Lei Liu, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Alexander Farrell

Cappa Publications

O-band InP etched facets lasers were heterogeneously integrated by micro-transfer-printing into a 1.54~\mu \text{m} deep recess created in the 3~\mu \text{m} thick oxide layer of a 220 nm SOI wafer. A 7\times 1.5\,\,\mu \text{m}^{2} cross-section, 2 mm long multimode polymer waveguide was aligned to the ridge post-integration by e-beam lithography with < 0.7~\mu \text{m} lateral misalignment and incorporated a tapered silicon waveguide. A 170 nm thick metal layer positioned at the bottom of the recess adjusts the vertical alignment of the laser and serves as a thermal via to sink the heat to the Si substrate. This strategy shows a roadmap for active polymer waveguide-based photonic integrated circuits.