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Full-Text Articles in Physical Sciences and Mathematics
Investigation On Laser Induced Deposition Of Cu-Based Materials At [Bmim]Bf4/Pt Electrode Interface, Min-Min Xu, Jin-Hua Mei, Jian-Lin Yao, Ren-Ao Gu
Investigation On Laser Induced Deposition Of Cu-Based Materials At [Bmim]Bf4/Pt Electrode Interface, Min-Min Xu, Jin-Hua Mei, Jian-Lin Yao, Ren-Ao Gu
Journal of Electrochemistry
By controlling the negative potential, Cu-based materials were deposited at the [BMIm]BF4/Pt electrode interface under the laser irradiation. The effects of laser power and irradiation time on the yield of deposition products were studied by using different laser powers and different irradiation time. The product yield could be directly determined by the size of deposition point through the observation from the optical microscope. Further mechanism study combined with the formula deduced that the thermal effect of the laser could make the electrode surface temperature rise 110 degrees, which can promote the occurrence of electrodeposition. By SEM characterization, the …
Electrodeposition Of Copper From A Choline Chloride Based Ionic Liquid, Rostom Ali M., Ziaur Rahman Md., Sankarsaha S.
Electrodeposition Of Copper From A Choline Chloride Based Ionic Liquid, Rostom Ali M., Ziaur Rahman Md., Sankarsaha S.
Journal of Electrochemistry
The electrodeposition of copper from a solution containing copper chloride in either an ethylene glycol (EG)-choline chloride based or a urea-choline chloride based ionic liquid has been carried out onto a steel cathode by constant current and constant potential methods at room temperature. The influences of various experimental conditions on electrodeposition and the morphology of the deposited layers have been investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). It is shown that very smooth, shiny and dense with good adherence and bright metallic coloured copper coatings can be obtained from both EG and urea based ionic liquids at …
Underpotential Deposition Of Copper On Pt(S)[N(100)X(110)] Stepped Surfaces, Gisbert Rubn, Climent Vctor, Herrero Enrique, M. Feliu Juan
Underpotential Deposition Of Copper On Pt(S)[N(100)X(110)] Stepped Surfaces, Gisbert Rubn, Climent Vctor, Herrero Enrique, M. Feliu Juan
Journal of Electrochemistry
The underpotential deposition of Cu on platinum stepped surfaces composed of (100) terraces and (110) monoatomic steps has been studied in different acidic solutions. It has been found that the initial stage of copper deposition on the surface takes place simultaneously on terrace and step sites, irrespective of the nature of the adsorbing anion. During the voltammetric deposition of a full monolayer, several peaks can be observed. The analysis of the dependence of the peak charge with the step density allows assigning the different peaks to different deposition sites. The peak appearing at most positive potentials corresponds to the deposition …
Effects Of Sulfide Ions On The Inhibiting Efficiency Of Eda As A Copper Corrosion Inhibitor In Dilute Hcl Solution, Wen-Juan Qu, Rong-Gui Du
Effects Of Sulfide Ions On The Inhibiting Efficiency Of Eda As A Copper Corrosion Inhibitor In Dilute Hcl Solution, Wen-Juan Qu, Rong-Gui Du
Journal of Electrochemistry
The anticorrosion action of EDA on copper in dilute HCl solution and the effect of sulfide ions on the inhibiting efficiency were studied by the Tafel plot method.The corrosion potential of Cu shifted to more positive value and the corrosion current density decreased after the addition of Na_(2)S to the solution.The results indicated that sulphide ions could increase the inhibiting efficiency of EDA because of the synergistic inhibition effect between EDA and Na_2S,resulting from the adsorption of HS~(-)on the surface of Cu,facilitated the adsorption of EDA to form a highly protective adsorbed layer which prevented Cu from corrosion.
Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu
Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu
Journal of Electrochemistry
Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the …
Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun
Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun
Journal of Electrochemistry
Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.
Effect Of Dissolved Oxygen On The Corrosion Behavior Of Coalesced Copper And Stainless Steel-206 In Acetic Solutions, Rong-Zong Hu, Xiong-Cao Zhao, Yu-Hua Weng, Chang-Jian Lin
Effect Of Dissolved Oxygen On The Corrosion Behavior Of Coalesced Copper And Stainless Steel-206 In Acetic Solutions, Rong-Zong Hu, Xiong-Cao Zhao, Yu-Hua Weng, Chang-Jian Lin
Journal of Electrochemistry
Linear sweeping technique and dissolving oxygen sensor were used to study the effect of dissolved oxygen and relating factors on the corrosion behavior of coalesced copper and stainless steel-206 in acetic solutions. It was found: 1. The existing of dissolved oxygen is one of the important factors, which strongly influenced the corrosion behavior of coalesced copper and stainless steel-206 in acetic solution. 2. The existing of dissolved oxygen is benefitial to the preventing stainless steel-206 from corrosion in acetic solutions, but damage to the preventing coalesced copper from corrosion. 3. At the high temperature since the dissolved oxygen was escaping …
Determination Of Copper In The Waste Water Of Plating By Chronocoulometry For Flowing Solution, Xin-Hua Lin, Wei Chen
Determination Of Copper In The Waste Water Of Plating By Chronocoulometry For Flowing Solution, Xin-Hua Lin, Wei Chen
Journal of Electrochemistry
The chronocoulometry for flowing solution was devoloped and applied to the detemination of copper(Ⅱ) in the waste water of plating.The linear range of copper(Ⅱ) was 2～16mg/L,and the relative standard deviation was less than 0.1% ( n =8).The recovery was 98%～103% for copper(Ⅱ) in the waste water.Chronocoulometry for flowing solution overcomed noise disturbance resulting from capacity current and variety of property of electrode surface.This method was sensitive,accurate and well reproducible.
Behavior Of Copper In Hydrogen Storage Alloy Microencapsulated By Copper, Dawei Zhang, Huatang Yuan, Huabin Yang, Zuoxiang Zhou, Yunshi Zhang
Behavior Of Copper In Hydrogen Storage Alloy Microencapsulated By Copper, Dawei Zhang, Huatang Yuan, Huabin Yang, Zuoxiang Zhou, Yunshi Zhang
Journal of Electrochemistry
Negative electrode made from Cu microencapsulated hydrogen storage alloy was studied by using cyclic voltammetry method. The results showed that copper as a coating material was of a certain stability in 5 mol/L KOH solution within the range of charge and discharge voltage. But when expanding the sweep voltage, the CV curve showed a pair of distinct oxidation reduction current peaks of Cu 2O formation at E =-0.3 V and Cu 2O reduction at E =-0.6 V. With charging discharging cycles, copper is liable to be oxidized to Cu 2O and further oxidized into CuO 2- 2. When charged again, …
Electrochemical Study Of The Corrosion Behavior Of Coalesced Copper And Sw-206 Stainless Steel In The Acetic-Acid Solution, Rongzong Hu, Changjian Lin, Jianguang Tan
Electrochemical Study Of The Corrosion Behavior Of Coalesced Copper And Sw-206 Stainless Steel In The Acetic-Acid Solution, Rongzong Hu, Changjian Lin, Jianguang Tan
Journal of Electrochemistry
In order to provide a theoretic and experimental consideration for the material selection and anit-corrosion in the petrochemical industries the corrosion behavior of coalesced copper and sw-206 stainless steel in the acetic acid solution was studied by electrochemical impedance spectroscopy and polarization techniques. The effects of the temperature,acetic acid concentration and solubilized oxygen in the acetic acid solution on the corrosion process of this two metals were analyzed. It was found that these effects obviously accelerate corrosion process for the coalesced copper,but no apparent influnce for the sw-206 stainless steel.In the the acetic acid solution,containing water and oxygen were beneficial …
Electrochemical Studies On Chemical Polishing Of Copper, Keping Han, Jingli Fang
Electrochemical Studies On Chemical Polishing Of Copper, Keping Han, Jingli Fang
Journal of Electrochemistry
Changes in specular reflectivity,weight loss,surface topograph and potential with time and current-potential curves during chemical polishing were determined.The results showed that chemical polishing was composed of the etching,polishing and pitting stage.The passivating film theory also applied to the chemical polishing.
Cyclic Voltammetric Calorimetry Studying The Deposition Of Copper Of Pt Electrodes, Yongchun Zhu, Robin H J Clark
Cyclic Voltammetric Calorimetry Studying The Deposition Of Copper Of Pt Electrodes, Yongchun Zhu, Robin H J Clark
Journal of Electrochemistry
In the present paper,cyclic voltammetric calorimetry has been used to study thedeposition of copper on platinum electrode from LiClO_4 aqueous solution. Cyclic voltammetricthermogram and cyclic voltammetric differential thermogram show that the deposition of copper on theelectrode is an exothermal process with a strong interaction between copper and platinum layer(-3227.0 kJ /mol).The electrochemical oxidation of the deposited copper is composed of twoprocesses :an endothermal activation process with 747.0 kJ/mol of activation enthalpy,and anexothermal oxidation reaction with-189.9 kJ/mol of the reaction enthalpy, which are accord withthe data from the theoritical estimation and thermodynamic handbook respectively.
Electrochemically Modified Glassy Carbon Electrode And Determination Of Copper By Anodic Stripping Voltammetry, Jinrui Xu, Yie Liu, Xiurun Zhuang
Electrochemically Modified Glassy Carbon Electrode And Determination Of Copper By Anodic Stripping Voltammetry, Jinrui Xu, Yie Liu, Xiurun Zhuang
Journal of Electrochemistry
This paper reported the glassy carbon electrode modified by cyclic voltammetrybetween-0. 1and + 1. 5 V(vs. SCE)in an aqueous solution containing catechol,formaldehyde andtalium hydroxide. The modified electrode can be applied to the determination of copper(Ⅱ) in water,and its sensitivity is about 35 times higher than that of unmedified glassy carbon electrede, Thequantitative limit with this modified electrede is 0. 1 ng/ml.