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A Low Temperature Co-Fired Ceramic (Ltcc) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module, Atanu Dutta
A Low Temperature Co-Fired Ceramic (Ltcc) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module, Atanu Dutta
Graduate Theses and Dissertations
The objective of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless stack is realized with two stand-alone power modules in a half-bridge configuration. Each stand-alone power module consists of two 1200 V 25 A silicon insulated-gate bipolar transistor (IGBT) devices in parallel and two 1200 V 20 A Schottky barrier diodes (SBD) in an antiparallel configuration. A novel interconnection scheme with conductive clamps and a spring loaded …