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Full-Text Articles in Engineering
Fast Data Pattern Based Electromagnetic Interference Evaluation For Ic Packaging, Nick K.H. Huang, Li (Lijun) Jun Jiang
Fast Data Pattern Based Electromagnetic Interference Evaluation For Ic Packaging, Nick K.H. Huang, Li (Lijun) Jun Jiang
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various data pattern …
The Development Of Near Field Probing Systems For Emc Near Field Visualization And Emi Source Localization, Hui He
Masters Theses
"The objectives of this research are to visualize the frequency dependent electromagnetic field distribution for electromagnetic compatibility (EMC) applications and the radiating source reconstruction on complex shaped electronic systems. This is achieved by combining near field probing with a system for automatically recording the probe position and orientation. Due to the complexity of the shape of the electronic systems of interest, and for utilizing the expertise of the user, the probe will be moved manually not robotically. Concurrently, the local near field will be recorded, associated with the location and displayed at near real time on the captured 3D geometry …