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Full-Text Articles in Engineering
In-Situ Investigation Of Slurry Flow Fields During Cmp, N. Mueller, Chris Rogers, Vincent Manno, Robert White, M. Moinpour
In-Situ Investigation Of Slurry Flow Fields During Cmp, N. Mueller, Chris Rogers, Vincent Manno, Robert White, M. Moinpour
Vincent P. Manno
The objective of this work is to obtain in situ slurry fluid flow data during the chemical mechanical planarization (CMP) process. Slurry flow affects the material removal processes, the creation of defects, and consumable use during CMP, and therefore impacts the cost and quality of polishing. Wafer-scale flow visualization using seeded slurry was accomplished for a variable applied load ( downforce), wafer rotation speed (0 and ), slurry injection locations, and various pad types (flat, grooved, and AC grooved). In situ pad conditioning was employed in all experiments. The data indicated complex slurry flow fields on the pad surface in …
Thermoelectric Module-Variable Conductance Heat Pipe Assemblies For Reduced Power Temperature Control, Corey Melnick, Marc Hodes, Gennady Ziskind, Martin Cleary, Vincent Manno
Thermoelectric Module-Variable Conductance Heat Pipe Assemblies For Reduced Power Temperature Control, Corey Melnick, Marc Hodes, Gennady Ziskind, Martin Cleary, Vincent Manno
Vincent P. Manno
Thermoelectric modules (TEMs) are used to precisely maintain the setpoint temperature of photonic components generating variable heat loads under varying ambient conditions. The non-component side of TEMs is mounted onto conventional heat sinks (CHSs). At any combination of setpoint temperature, heat load and ambient temperature, there is a unique thermal resistance between the non-component side of a TEM and the ambient corresponding to minimal TEM power consumption. Indeed, a zero thermal resistance heat sink minimizes power consumption when a TEM operates in refrigeration mode, but when it operates in heating mode a relatively high thermal resistance one is optimal. This …
Stick-Slip Transitions In Chemical Mechanical Planarization, J. Vlahakis, Vincent Manno, Chris Rogers, Robert White
Stick-Slip Transitions In Chemical Mechanical Planarization, J. Vlahakis, Vincent Manno, Chris Rogers, Robert White
Vincent P. Manno
As semiconductor device sizes continue to shrink and economic realities drive ever increasing yield targets, achieving wafer scale planarity through the application of chemical mechanical planarization (CMP) has become increasingly challenging. The dynamics of the wafer–pad interface is critical to maintaining this uniformity. Utilizing measured friction coefficients (0.3–0.6), we report on the transitions from a smooth planarization regime to a stick-slip regime and vice versa over a set of two applied vertical loads and three relative velocities during the CMP process. Finally, we note a correlation between time spent in a stick-slip regime and platen velocity.
Optimized Thermoelectric Module-Heat Sink Assemblies For Precision Temperature Control, Rui Zhang, David Brooks, Marc Hodes, Vincent Manno
Optimized Thermoelectric Module-Heat Sink Assemblies For Precision Temperature Control, Rui Zhang, David Brooks, Marc Hodes, Vincent Manno
Vincent P. Manno
Robustprecision temperature control of photonics components is achieved by mountingthem on thermoelectric modules (TEMs) which are in turn mountedon heat sinks. However, the power consumption of TEMs ishigh because high currents are driven through Bi2Te3-based semiconducting materialswith high electrical resistivity and finite thermal conductivity. This problemis exacerbated when the ambient temperature surrounding a TEM variesin the usual configuration where the air-cooled heat sink aTEM is mounted to is of specified thermal resistance. Indeed,heat sinks of negligible and relatively high thermal resistances minimizeTEM power consumption for sufficiently high and low ambient temperatures,respectively. Optimized TEM-heat sink assemblies reduce the severity of thisproblem. …
Measurement Of Microscale Shear Forces During Chemical Mechanical Planarization, Robert White, Andrew Mueller, Minchul Shin, Douglas Gauthier, Vincent Manno, Chris Rogers
Measurement Of Microscale Shear Forces During Chemical Mechanical Planarization, Robert White, Andrew Mueller, Minchul Shin, Douglas Gauthier, Vincent Manno, Chris Rogers
Vincent P. Manno
Polydimethylsiloxane (PDMS) posts with a diameter of 80 mu m were used to measure the shearing forces at the wafer-pad interface during chemical mechanical planarization (CMP). Measurements are made at 10 kHz with measurable forces between 40 and 400 mu N. The structures were polished using a stiff, ungrooved pad and 3 wt % fumed silica slurry at velocities of 0.3 and 0.6 m/s and average wafer-pad normal load of 5.0 and 9.1 kPa. Due to the small fraction of the pad that contacts the wafer, the local microscale forces can be much larger than the global average force might …
Transient Thermomechanical Simulation Of Laser Hammering In Optoelectronic Package Manufacturing, Ben Ting, Vincent Manno
Transient Thermomechanical Simulation Of Laser Hammering In Optoelectronic Package Manufacturing, Ben Ting, Vincent Manno
Vincent P. Manno
Laser hammering (LH) is a process used in the manufacturing of butterfly optoelectronic packages to correct laser-to-fiber misalignment that occurs when the semiconductor lasers are welded in place. High-power, precisely positioned pulsed lasers are used in LH to induce deformation of the fiber support housing to, in turn, induce realignment. A thermomechanical modeling study of LH is reported in this paper, which focuses on the degree to which a steady-state model can predict the asymptotic state of a transient response subjected to a periodic laser excitation. A baseline, two-dimensional fiber mounting/ferrule geometry is employed in a finite element analysis simulation …
Simulated Effects Of Measurement Noise On Contact Measurements Between Rough And Smooth Surfaces, Caprice Gray, Robert White, Vincent Manno, Chris Rogers
Simulated Effects Of Measurement Noise On Contact Measurements Between Rough And Smooth Surfaces, Caprice Gray, Robert White, Vincent Manno, Chris Rogers
Vincent P. Manno
To test the accuracy of optically measuring contact, we examined the height distribution histogram of a simulated rough surface contacting a smooth surface. We qualified the technique sensitivity as a function of the inverse signal-to-noise ratio having values ranging from 0 to 0.3. An explanation of how the analysis technique can be applied to Dual Emission Laser-Induced Fluorescence (DELIF) measurements is provided.
Synchronous, In-Situ Measurements In Chemical Mechanical Planarization, J. Vlahakis, Chris Rogers, Vincent Manno, Robert White, M. Moinpour, D. Hooper, S. Anjur
Synchronous, In-Situ Measurements In Chemical Mechanical Planarization, J. Vlahakis, Chris Rogers, Vincent Manno, Robert White, M. Moinpour, D. Hooper, S. Anjur
Vincent P. Manno
Achieving device- and wafer-scale planarity in integrated circuit manufacturing is increasingly challenging as device sizes are reduced to and smaller, and wafer sizes are increased from . Hence a better understanding of chemical mechanical planarization (CMP) processes is needed. We report the synchronous, in situ measurement of wafer forces [coefficient of friction (CoF)] and wafer orientation during CMP polishing of BK7 glass wafers and the ex situ measurement of material removal rate (MRR) over a wide range of applied vertical loads and relative rotational velocities. MRR appears to be Prestonian and was significantly reduced by moving the slurry injection location …
Viewing Asperity Behavior Under The Wafer During Chemical Mechanical Polishing, Caprice Gray, Daniel Apone, Chris Rogers, Vincent Manno, Chris Barns, Mansour Moinpour, Sriram Anjur, Ara Philipossian
Viewing Asperity Behavior Under The Wafer During Chemical Mechanical Polishing, Caprice Gray, Daniel Apone, Chris Rogers, Vincent Manno, Chris Barns, Mansour Moinpour, Sriram Anjur, Ara Philipossian
Vincent P. Manno
Recent experimental advances using dual emission laser induced fluorescence and image processing have provided high spatial and temporal resolution maps of the slurry layer during chemical mechanical polishing (CMP). Intensity differences in the images correspond to fluid layer thickness variations as the slurry passes between different pad and wafer topographies. Asperities expand under 14 μm deep wells and are compressed beyond the trailing edge of the wells. Air pockets travel from the leading to the trailing edge of the wafer through 27 μm deep wells. The pads tested were Freudenberg FX9, Rodel IC1000, and experimental pads from Cabot Microelectronics.
In-Situ Measurement Of Pressure And Friction During Cmp Of Contoured Wafers, A. Scarfo, Vincent Manno, Chris Rogers, Sriram Anjur, Mansour Moinpour
In-Situ Measurement Of Pressure And Friction During Cmp Of Contoured Wafers, A. Scarfo, Vincent Manno, Chris Rogers, Sriram Anjur, Mansour Moinpour
Vincent P. Manno
In situ fluid film pressure and interfacial friction measurements during chemical mechanical planarization (CMP) are reported over a range of applied loads (27.6-41.4 kPA or 4-6 psi) and relative pad/wafer velocities . The slurry film pressure beneath contoured test wafers was measured using a novel experimental setup that enables dynamic data collection. The friction data have a repeatability of . The uncertainty of the pressure measurements and the computed down forces were and 20%, respectively. The data indicate that wafer shape, specifically global curvature, is a significant factor in determining the lubrication regime during CMP. Full hydrodynamic lubrication, in which …
Modeling Of Dual Emission Laser Induced Fluorescence For Slurry Thickness Measurements In Chemical Mechanical Polishing, Caprice Gray, Chris Rogers, Vincent Manno, Robert White
Modeling Of Dual Emission Laser Induced Fluorescence For Slurry Thickness Measurements In Chemical Mechanical Polishing, Caprice Gray, Chris Rogers, Vincent Manno, Robert White
Vincent P. Manno
Dual emission laser induced fluorescence (DELIF) is a technique for measuring the instantaneous thin fluid film thickness in dynamic systems. Two fluorophores within the system produce laser induced emissions that are filtered and captured by two cameras. The ratio of the images from these cameras is used to cancel the effect of the laser beam profile on the image intensity. The resultant intensity ratio can be calibrated to a fluid film thickness. The utilization of a 2-dye system when applied to Chemical Mechanical Polishing (CMP) is complicated by the fluorescence of the polymeric polishing pad and the light scattering particles …