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Full-Text Articles in Engineering
Using A Nondispersive Wave Propagation For Measuring Dynamic Fracture Initiation Toughness Of Materials: Experimental And Numerical Based Study, Ali Fahad Fahem
Using A Nondispersive Wave Propagation For Measuring Dynamic Fracture Initiation Toughness Of Materials: Experimental And Numerical Based Study, Ali Fahad Fahem
Theses and Dissertations
Fracture mechanics has been a subject of great interest in the engineering community for decades. During this period, fracture parameters such as Stress Intensity Factor (SIF), J-integral, and Crack-Tip Opening Displacement (CTOD) have been developed and used to characterize the fracture properties of most engineering materials under quasi-static loading condition. Usually, these properties are obtained experimentally by using standard methods such as ASTM E399, E1820 or E1920 to evaluate the stress intensity factor ������ ������������, elastic-plastic toughness ������ ������������ and crack tip opening displacement (CTOD) respectively. Conversely, most critical engineering applications are subjected to a sudden or high strain rate …
Binder Jetting: A Review Of Process, Materials, And Methods, Mohsen Ziaee, Nathan B. Crane
Binder Jetting: A Review Of Process, Materials, And Methods, Mohsen Ziaee, Nathan B. Crane
Faculty Publications
Binder Jet printing is an additive manufacturing technique that dispenses liquid binding agent on powder. Layers are formed repeatedly to build up a physical article. Binder jetting (BJ) can be adapted to almost any powder with high production rates. The BJ process utilizes a broad range of technologies including printing methods, powder deposition, dynamic binder/powder interaction, and post-processing methods. A wide variety of materials have been demonstrated including polymers, metals, and ceramics, but a common challenge is developing printing and post-processing methods that maximize part performance. This article presents a broad review of technologies and approaches that have been applied …
Retaining Ring Material Wear Analysis And Testing, Thomas Headland, Barten Hansen, Austin Fisher, Kevin Hurtado
Retaining Ring Material Wear Analysis And Testing, Thomas Headland, Barten Hansen, Austin Fisher, Kevin Hurtado
Mechanical Engineering
The chemical mechanical planarization (CMP) of wafers for integrated circuits is an essential – yet expensive – step in their manufacture. CMP machine down-time due to the replacement of process consumables, such as wafer retaining rings, is a significant contributor to the process cost. To reduce the operational cost of their CMP machines, Revasum is interested in exploring new designs and materials for wafer retaining rings to increase their operational lifetime. Background research showed that there is currently no suitable method for testing new retaining ring designs and materials for wear characteristics specific to the CMP process. Available wear testing …
Development Of Flexible Photo-Mechanoluminescent Polymeric Based Systems, Carlos Hernandez
Development Of Flexible Photo-Mechanoluminescent Polymeric Based Systems, Carlos Hernandez
Theses and Dissertations
The project focuses on the creation of nanofiber systems with enhanced photo-mechanoluminescent response and high mechanical flexibility to further enhance promising optical applications. Lanthanide-Polyvinyl Di-Fluoride fiber systems were created using centrifugal spinning and characterized using SEM, FTIR, XPS, DSC, XRD, and PL. Fibers luminescence response was gotten when induced by ultraviolet light and the application of an impact force.
Feed Control: Composite Recycle, Rosy Perez
Feed Control: Composite Recycle, Rosy Perez
All Undergraduate Projects
The Boeing Company gave Central Washington University an opportunity for students to research and come up with an idea to reduce costs and landfill waste caused by the trimmings from the 777x composite wing pieces. The engineering and manufacturing for this project is about transporting composite material through to the delamination and chipper process. The delamination process uses a ram to press two claw shaped devices together that bends and deforms the material in opposite directions. The chipper process uses counter rotating saw blades spaced 1/8” apart to produce small shredded material. It is important for this newly designed feed …
Mechanical Characterization Of Anisotropic Fused Deposition Modeled Polylactic Acid Under Combined Monotonic Bending And Torsion Conditions, Aaron T. Santomauro
Mechanical Characterization Of Anisotropic Fused Deposition Modeled Polylactic Acid Under Combined Monotonic Bending And Torsion Conditions, Aaron T. Santomauro
Honors Undergraduate Theses
Mechanical strength of polylactic acid (PLA) is increasingly relevant with time because of its attractive mechanical properties and 3D printability. Additive manufacturing (AM) methods, such as fused deposition modeling (FDM), stereolithography (SLA), and selective laser sintering (SLS), serve a vital role in assisting designers with cheap and efficient generation of the desired components. This document presents research to investigate the anisotropic response of multi-oriented PLA subjected to multiple monotonic loading conditions. Although empirical data has previously been captured for multi-oriented PLA under tensile and compressive loading conditions, the data has yet to be applied with regard to a representative component …