Engineering Commons^™

A Microslip Model Of The Bonding Process In Ultrasonic Wire Bonders Part I: Transient Response, C M. Hu, N Guo, H Du, W H. Li, M Chen

Dr Haiping Du

Ultrasonic wire bonders with precision capillary tips are widely used for bonding electrical wires to IC chips and circuits. The industry is driving wire-bonding technology towards increased yields, decreased pitch, and ever decreasing cost. However, many technical and material issues will be involved in achieving these goals, such as bond quality monitoring, new failure modes, reliability problems in new plastic mold compounds, and increasing wire sweep problems, in particular lack of the quantitative understanding and validated mathematical model of the bonding process. In this paper, a microslip model is proposed for the bonding process based on the bonding pattern observed, …