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Conformal Electronics Packaging Through Additive Manufacturing And Micro-Dispensing, Richard I. Olivas
Conformal Electronics Packaging Through Additive Manufacturing And Micro-Dispensing, Richard I. Olivas
Open Access Theses & Dissertations
Realizing electronic systems that are conformal with curved or complex surfaces is difficult if not impossible with conventional fabrication techniques, which require rigid, two dimensional, printed circuit boards (PCB). Flexible copper based fabrication is widely available commercially providing conformance, but not simultaneously stiffness. As a result, these systems are susceptible to reliability problems if repeatedly bent or stretched. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing can produce shapes of arbitrary and complex form that also allows for 1) miniature cavities for insetting electronic components and 2) conductive traces for electrical interconnect between components. The fabrication …
Microstructural Architecture Developed In The Fabrication Of Solid And Open-Cellular Copper Components By Additive Manufacturing Using Electron Beam Melting, Diana Alejandra Ramirez
Microstructural Architecture Developed In The Fabrication Of Solid And Open-Cellular Copper Components By Additive Manufacturing Using Electron Beam Melting, Diana Alejandra Ramirez
Open Access Theses & Dissertations
The fabrication of Cu components were first built by additive manufacturing using electron beam melting (EBM) from low-purity, atomized Cu powder containing a high density of Cu2O precipitates leading to a novel example of precipitate-dislocation architecture. These microstructures exhibit cell-like arrays (1-3µm) in the horizontal reference plane perpendicular to the build direction with columnar-like arrays extending from ~12 to >60 µm in length and corresponding spatial dimensions of 1-3 µm. These observations were observed by the use of optical metallography, and scanning and transmission electron microscopy. The hardness measurements were taken both on the atomized powder and the Cu components. …