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Full-Text Articles in Engineering
Dc Power-Bus Design Using Fdtd Modeling With Dispersive Media And Surface Mount Technology Components, Xiaoning Ye, Marina Koledintseva, Min Li, James L. Drewniak
Dc Power-Bus Design Using Fdtd Modeling With Dispersive Media And Surface Mount Technology Components, Xiaoning Ye, Marina Koledintseva, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
DC power-bus modeling in high-speed digital design using the finite-difference time-domain (FDTD) method is demonstrated herein. The dispersive character of the dielectric layers used in printed circuit board substrates is taken into account in this study. In particular, FR-4 is considered. The complex permittivity of the dielectric is approximated by a Debye model. A wide-band frequency response (100 MHz-5 GHz) is obtained through a single FDTD simulation. Good agreement is achieved between the modeled and measured results for a typical dc power-bus structure with multiple surface mount technology (SMT) decoupling capacitors placed on the printed circuit board (PCB). The FDTD …
The Effects Of Via Transitions On Differential Signals, Chen Wang, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, James L. Drewniak
The Effects Of Via Transitions On Differential Signals, Chen Wang, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Vias in differential transmission lines have been modeled using the finite-difference time-domain (FDTD) method. The velocity that the differential signal propagated through the vias was estimated. Differential S-parameters were calculated up to 50 GHz. Below 10 GHz, the differential signal can propagate through vias without much reflection and distortion. However, as frequency increases, the reflection from the vias and the loss of differential power become significant.
Emi Considerations In Selecting Heat-Sink-Thermal-Gasket Materials, Yu Huang, J. E. Butler, M. De Sorgo, Richard E. Dubroff, Todd H. Hubing, James L. Drewniak, Thomas Van Doren
Emi Considerations In Selecting Heat-Sink-Thermal-Gasket Materials, Yu Huang, J. E. Butler, M. De Sorgo, Richard E. Dubroff, Todd H. Hubing, James L. Drewniak, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Specific design criteria are proposed to mitigate radiated emissions from a resonant enclosure excited by a heat sink acting as a microstrip patch antenna source. In this particular application, the EMI mechanism is assumed to be due to coupling from the dominant TMz010 mode to one or more resonant modes associated with the enclosure dimensions. The enclosure is then presumed to radiate, at the enclosure resonance frequencies, through one or more apertures, slots, or seams. The EMI-reduction strategy consists of shifting the resonant frequency of the dominant-patch antenna mode by dielectrically loading the patch antenna with thermal-gasket material …
Mitigating Power Bus Noise With Embedded Capacitance In Pcb Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Mitigating Power Bus Noise With Embedded Capacitance In Pcb Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
This paper investigates the power bus noise and power bus impedance of printed circuit boards with four different kinds of embedded capacitance. These boards have power-ground plane pairs separated by a very thin layer of material with high dielectric permittivity. It is shown that embedded capacitance effectively reduces power bus noise over the entire frequency range evaluated (up to 5 GHz).