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Full-Text Articles in Engineering
Anticipating Emi From Coupling Between High-Speed Digital And I/O Lines, Wei Cui, Min Li, Xiao Luo, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Anticipating Emi From Coupling Between High-Speed Digital And I/O Lines, Wei Cui, Min Li, Xiao Luo, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
The increasing speed of digital circuit design as well as the density of printed circuit board (PCB) layouts often result in more challenging electromagnetic interference (EMI) problems. The coupling between a high-speed digital line and an I/O line can be a primary EMI coupling path, and the attached cable a dominant radiator. This mechanism is studied and modeled herein in a multi-stage modeling fashion. EMI modeling is developed for coupling between the transmission lines, and the attached cable as the EMI antenna. Finally, the EMI is calculated for the coupled noise driving the attached cable. The agreement between the modeled …
Rf Isolation Using Power Islands In Dc Power Bus Design, Jun Fan, Yong Ren, Juan Chen, David M. Hockanson, Hao Shi, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Rf Isolation Using Power Islands In Dc Power Bus Design, Jun Fan, Yong Ren, Juan Chen, David M. Hockanson, Hao Shi, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Power island structures are often employed for minimizing the propagation of high-frequency noise on DC power buses. The rationale is based on introducing a series impedance in the power plane to provide isolation of a noise source from the rest of the PCB design. The power island concept is investigated herein experimentally, to determine its noise mitigation attributes and limitations. A modeling approach that is suitable for arbitrary PCB island geometries including lumped SMT decoupling capacitors is also presented. The modeling and measurements indicate that island structures can achieve some degree of isolation under certain conditions.
Emi Associated With Inter-Board Connection For Module-On-Backplane And Stacked-Card Configurations, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Emi Associated With Inter-Board Connection For Module-On-Backplane And Stacked-Card Configurations, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of connections were investigated experimentally including an open pin field connection, an "ideal" semi-rigid coaxial cable connection, and a production connector. Both microstrip and stripline signal routing on the PCB were investigated. The results indicated signal routing on the PCBs or the inter-board connection can dominate the EMI process. Several cases of connector geometries were studied using FDTD modeling and good agreement was achieved between the measured and FDTD results.