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Full-Text Articles in Engineering
Anticipating Emi From Coupling Between High-Speed Digital And I/O Lines, Wei Cui, Min Li, Xiao Luo, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Anticipating Emi From Coupling Between High-Speed Digital And I/O Lines, Wei Cui, Min Li, Xiao Luo, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
The increasing speed of digital circuit design as well as the density of printed circuit board (PCB) layouts often result in more challenging electromagnetic interference (EMI) problems. The coupling between a high-speed digital line and an I/O line can be a primary EMI coupling path, and the attached cable a dominant radiator. This mechanism is studied and modeled herein in a multi-stage modeling fashion. EMI modeling is developed for coupling between the transmission lines, and the attached cable as the EMI antenna. Finally, the EMI is calculated for the coupled noise driving the attached cable. The agreement between the modeled …
Emi Associated With Inter-Board Connection For Module-On-Backplane And Stacked-Card Configurations, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Emi Associated With Inter-Board Connection For Module-On-Backplane And Stacked-Card Configurations, Xiaoning Ye, Jim Nadolny, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of connections were investigated experimentally including an open pin field connection, an "ideal" semi-rigid coaxial cable connection, and a production connector. Both microstrip and stripline signal routing on the PCB were investigated. The results indicated signal routing on the PCBs or the inter-board connection can dominate the EMI process. Several cases of connector geometries were studied using FDTD modeling and good agreement was achieved between the measured and FDTD results.
Microstrip Coupling Algorithm Validation And Modification Based On Measurements And Numerical Modeling, Theodore M. Zeeff, Chris E. Olsen, Todd H. Hubing, James L. Drewniak, Richard E. Dubroff
Microstrip Coupling Algorithm Validation And Modification Based On Measurements And Numerical Modeling, Theodore M. Zeeff, Chris E. Olsen, Todd H. Hubing, James L. Drewniak, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
In this study, mutual capacitance and inductance between two coupled traces is measured and computed to validate and simplify coupling algorithms used in an expert system software package. The algorithm's applicability to common microstrip configurations is tested through comparisons between FEM based solutions, |S21| measurements and the algorithm solutions under several permutations of a test board. Adjustments to the original algorithm are proposed that reduce computation times with out significantly affecting the accuracy of the result.