Engineering Commons^™

Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera

Legacy Theses & Dissertations (2009 - 2024)

One of the key challenges in fabricating narrower and higher aspect ratio interconnects using damascene technology has been achieving an ultra-thin (~2 nm) and continuous Cu seed coverage on trench sidewalls. The thin seed is prone to agglomeration because of poor Cu wetting on the Ta liner. Using in-situ conductance measurements, the effect of lowering the substrate temperature during Cu seed deposition has been studied on tantalum (Ta) and ruthenium (Ru) liner surfaces. On a Ta surface, it was found that lowering the deposition temperature to -65°C increases the nucleation rate of the Cu thin film, and reduces the minimum …

Variation Of Thickness Of Hard Anodic Films, Alphons Raymond O'Konski

Theses

An investigation was made of the effects of varying processing conditions on the thickness of anodic films produced by the Martin Hard Coat (4) process on commercially pure aluminum and nine aluminum alloys.

This study was conducted to provide sufficient data for designing coating thicknesses on aircraft accessory parts that would conform to the close tolerances maintained in the course of manufacture of precision components. Coating thicknesses up to 0.0051 in. were obtained. Changes in electrolyte strength, temperature of the bath, alloy composition, and current density were made to see their effect on the thickness of the film and growth …