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Full-Text Articles in Engineering

Effect Of Annealing On Copper Thin Films:The Classical Size Effect And Agglomeration, Parag Gadkari Jan 2005

Effect Of Annealing On Copper Thin Films:The Classical Size Effect And Agglomeration, Parag Gadkari

Electronic Theses and Dissertations

With continued shrinking of CMOS technology to reduce the gate delay times, an increase in the resistivity of the metal corresponding to the wire dimension is a concern. This phenomenon of increase in resistivity with decreasing dimension of the thin metallic film or interconnect is known as the "classical size effect". Various theories have been postulated to explain the phenomenon of classical size effect; these theories can be broadly classified as resistivity due to scattering arising from surface and grain boundaries. The total resistivity of metals depends on the electron scattering due to impurities, phonons, surfaces, grain boundaries, and other …


The Effect Of Colloidal Stability On The Heat Transfer Characteristics Of Nanosilica Dispersed Fluids, Manoj Venkataraman Jan 2005

The Effect Of Colloidal Stability On The Heat Transfer Characteristics Of Nanosilica Dispersed Fluids, Manoj Venkataraman

Electronic Theses and Dissertations

Addition of nano particles to cooling fluids has shown marked improvement in the heat transfer capabilities. Nanofluids, liquids that contain dispersed nanoparticles, are an emerging class of fluids that have great potential in many applications. There is a need to understand the fundamental behavior of nano dispersed particles with respect to their agglomeration characteristics and how it relates to the heat transfer capability. Such an understanding is important for the development and commercialization of nanofluids. In this work, the stability of nano particles was studied by measuring the zeta potential of colloidal particles, particle concentration and size. Two different sizes …