Engineering Commons^™

Three-Dimensional Structural Electronic Integration For Small Satellite Fabrication, Cassie Gutierrez

Open Access Theses & Dissertations

The ability to realize truly three-dimensional electronic circuits is complicated if not impossible using traditional fabrication techniques. Such techniques are limited to the use of two dimensional printed circuit boards (PCBs), and require various dissonant processes which exhaust time, volume and cost. Due to the nature of Additive Manufacturing (AM) such problems are diminished and in some ways completely overcome. Additive Manufacturing allows for a higher range of design freedom along conformal surfaces, as well as unit level customization; it is the threshold for embedded electronics, allowing for three-dimensional circuitry in ways traditional fabrication is unfeasible. In such ways, additive …