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Conformal Electronics Packaging Through Additive Manufacturing And Micro-Dispensing, Richard I. Olivas

Open Access Theses & Dissertations

Realizing electronic systems that are conformal with curved or complex surfaces is difficult if not impossible with conventional fabrication techniques, which require rigid, two dimensional, printed circuit boards (PCB). Flexible copper based fabrication is widely available commercially providing conformance, but not simultaneously stiffness. As a result, these systems are susceptible to reliability problems if repeatedly bent or stretched. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing can produce shapes of arbitrary and complex form that also allows for 1) miniature cavities for insetting electronic components and 2) conductive traces for electrical interconnect between components. The fabrication …