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Full-Text Articles in Engineering

Sequential Optimization For Stressor-Informed Test Planning Through Integration Of Experimental And Simulated Data, Jacob Brecheisen May 2024

Sequential Optimization For Stressor-Informed Test Planning Through Integration Of Experimental And Simulated Data, Jacob Brecheisen

Data Science Undergraduate Honors Theses

This technical report details an innovative approach in reliability engineering aimed at maximizing system durability through a synergistic use of physical experimentation and computer-based modeling. Our methodology explores the efficient design and analysis of computer experiments and physical tests to facilitate accelerated reliability growth, while leveraging a sequential integration of data from these two distinct sources: costly physical experiments, characterized by random errors, and inexpensive computer simulations, marked by inherent systematic errors. The key innovation lies in the adoption of a closed-loop design and analysis method. This method begins by identifying a viable subset of important environmental stressors—such as temperature, …


Capabilities Of Sintered Silver As A High Temperature Packaging Material, Bakhtiyar Mohammad Nafis Dec 2023

Capabilities Of Sintered Silver As A High Temperature Packaging Material, Bakhtiyar Mohammad Nafis

Graduate Theses and Dissertations

With electrification progressing across many sectors including industry, automotive and aerospace, the power density requirements are changing. The increased power density results in higher and higher ambient temperatures that electronics are exposed to. The response has been to move towards wide bandgap (WBG) semiconductor devices that can withstand much greater temperatures and can operate at much higher voltages than silicon. Additionally, these WBG devices deliver low drain-source on resistance (RDS_on) capabilities, enabling high current power modules that increase power density even further. This also requires the packaging to evolve in order to withstand the new requirements. As a result, researchers …


Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri Dec 2021

Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri

Graduate Theses and Dissertations

The trend toward miniaturization of electronic devices to fulfill Moore’s law introduces new reliability concerns to the electronic packaging process while worsening existing primary challenges. In solder interconnect specifically, temperature cycling is one of the prominent failure threats. However, with further downscaling of the flip-chip solder connections, electromigration also present a precarious failure mode in these interconnects. On the other hand, understanding the degradation mechanism in solders is crucial for the power electronic products' reliability considering the industrial tendency to replace wirebonds with solder attachment while improving the current carry capacity. This dissertation utilizes FEA simulation and an experimental approach …


Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis Dec 2021

Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis

Graduate Theses and Dissertations

The reliability of electronic devices is dependent upon the conditions to which they are subject. Temperature variations coupled with differences in thermal expansion between bonded materials results in thermomechanical stresses to build up, which can instigate failure in the interconnects or other critical regions. With the move towards electrification in the automotive industry, there is the increasingly important consideration of powertrain electronics reliability, the pertinent conditions being governed by the drive cycle or mission profile of the vehicle. The mission profile determines the power dissipated by the electronic devices, which determines the peak and mean temperature, temperature swing and the …


Efficiently Estimating Survival Signature And Two-Terminal Reliability Of Heterogeneous Networks Through Multi-Objective Optimization, Daniel Bruno Lopes Da Silva Jul 2021

Efficiently Estimating Survival Signature And Two-Terminal Reliability Of Heterogeneous Networks Through Multi-Objective Optimization, Daniel Bruno Lopes Da Silva

Graduate Theses and Dissertations

The two-terminal reliability problem is a classical reliability problem with applications in wired and wireless communication networks, electronic circuit design, computer networks, and electrical power distribution, among other systems. However, the two-terminal reliability problem is among the hardest combinatorial problems and is intractable for large, complex networks. Several exact methods to solve the two-terminal reliability problem have been proposed since the 1960s, but they have exponential time complexity in general. Hence, practical studies involving large network-type systems resort to approximation methods to estimate the system's reliability. One attractive approach for quantifying the reliability of complex systems is to use signatures, …


High Temperature Degradation In Gan-Based Hall Effect Sensors, Alexis Anne Krone Jul 2021

High Temperature Degradation In Gan-Based Hall Effect Sensors, Alexis Anne Krone

Graduate Theses and Dissertations

This research focuses on understanding the effects of accelerated aging through temperature and environment on novel gallium nitride-based Hall effect magnetic field sensors and determining device reliability under electric vehicle operating conditions. The device reliability was modeled using accelerated aging for the temperatures of 200 °C, 350 °C, 450 °C, and 600 °C under various time steps unique to each temperature and either air, which is identical to operating circumstances, or argon, which would model the hermetic packaging environment. Using a high temperature furnace and oven, devices underwent high temperature storage tests at a chosen temperature and time step. Afterwards, …


Robust Control Of A Multi-Phase Interleaved Boost Converter For Photovoltaic Application Using Μ-Synthesis Approach, Badur Mueedh Alharbi Dec 2020

Robust Control Of A Multi-Phase Interleaved Boost Converter For Photovoltaic Application Using Μ-Synthesis Approach, Badur Mueedh Alharbi

Graduate Theses and Dissertations

The high demand of energy efficiency has led to the development power converter topologies and control system designs within the field of power electronics. Recent advances of interleaved boost converters have showed improved features between the power conversion topologies in several aspects, including power quality, efficiency, sustainability and reliability.

Interleaved boost converter with multi-phase technique for PV system is an attractive area for distributed power generation. During load variation or power supply changes due to the weather changes the output voltage requires a robust control to maintain stable and perform robustness.

Connecting converters in series and parallel have the advantages …


Study On New Sampling Plans And Optimal Integration With Proactive Maintenance In Production Systems, Sinan Obaidat Jul 2020

Study On New Sampling Plans And Optimal Integration With Proactive Maintenance In Production Systems, Sinan Obaidat

Graduate Theses and Dissertations

Sampling plans are statistical process control (SPC) tools used mainly in production processes. They are employed to control processes by monitoring the quality of produced products and alerting for necessary adjustments or maintenance. Sampling is used when an undesirable change (shift) in a process is unobservable and needs time to discover. Basically, the shift occurs when an assignable cause affects the process. Wrong setups, defective raw materials, degraded components are examples of assignable causes. The assignable cause causes a variable (or attribute) quality characteristic to shift from the desired state to an undesired state.

The main concern of sampling is …


Assessing The Repeatability Of Clinical Tests In People With And Without Flexion-Induced Neck Pain, Ashton Human Dec 2019

Assessing The Repeatability Of Clinical Tests In People With And Without Flexion-Induced Neck Pain, Ashton Human

Graduate Theses and Dissertations

The accessibility of mobile technology has improved productivity but can contribute to musculoskeletal disorders due to the posture associated with using such devices. Neck flexion, a posture assumed by smartphone users, has been shown as a risk factor for the development of clinical neck pain if sustained for prolonged periods. Determining the individuals who are naturally more predisposed to develop flexion-induced neck pain can aid in the prevention and treatment of musculoskeletal disorders. The purpose of this thesis is to assess the repeatability of clinical tests between trials over the course of two days in young adults who do and …


H2 Control For Improved Stability Of Multi-Area Electric Power System With High Levels Of Inverter-Based Generation, Muthanna Abdulkareem Al-Sarray May 2019

H2 Control For Improved Stability Of Multi-Area Electric Power System With High Levels Of Inverter-Based Generation, Muthanna Abdulkareem Al-Sarray

Graduate Theses and Dissertations

Increased generation capacity from non-dispatchable energy resources such as wind and solar has created challenges to ensuring the reliable delivery of electric power. This research develops a systematic three-step method of assessing the reliability of electric power systems under a variety of different possible fault conditions to ensure that overall system stability is preserved in a manner the meets regulatory requirements. The first step is a risk-based reliability method (RBRM) that accounts for the probability of a line outage versus the severity of impact. This allows system planners to judiciously allocate expenses for reliability improvements based on the greatest economic …


Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut Dec 2018

Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut

Graduate Theses and Dissertations

The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability …


Essays On Optimization And Modeling Methods For Reliability And Reliability Growth, Thomas Paul Talafuse Aug 2016

Essays On Optimization And Modeling Methods For Reliability And Reliability Growth, Thomas Paul Talafuse

Graduate Theses and Dissertations

This research proposes novel solution techniques in the realm of reliability and reliability growth. We first consider a redundancy allocation problem to design a system that maximizes the reliability of a complex series-parallel system comprised of components with deterministic reliability. We propose a new meta-heuristic, inspired by the behavior of bats hunting prey, to find component allocation and redundancy levels that provide optimal or near-optimal system reliability levels. Each component alternative has an associated cost and weight and the system is constrained by cost and weight factors. We allow for component mixing within a subsystem, with a pre-defined maximum level …


Use Of Response Surfaces In The Design Of A Simple Step Stress Accelerated Test Plan, Alexander H. Wong May 2016

Use Of Response Surfaces In The Design Of A Simple Step Stress Accelerated Test Plan, Alexander H. Wong

Graduate Theses and Dissertations

In designing accelerated testing plans, cost is a factor that is missing in much of the literature. This paper explicits considers cost by developing an optimization model with the objective to minimize costs for a simple step stress accelerated test plan. Two methodologies are employed. One is an optimization approach in which an attempt is made to quantify the behavior of a series-parallel hardware system over all stages of testing using a response surface, and then an optimization model is used to determine the settings for stresses and failure mode modifications for all stages of testing prior to the start …