Engineering Commons^™

Low Pressure Chemical Vapor Deposition (Lpcvd) Of Titanium Nitride : Synthesis And Characterization, Sameer Narsinha Dharmadhikari

Theses

Titanium tetrachioride and ammonia were used as precursors in a Jow pressure chemical vapor deposition process to deposit titanium nitride films on silicon wafers. The process was carried out at temperatures from 450 to 850 C and the activation energy for the reaction was determined. The order of the reaction, with respect to the partial pressures of the reactant gases, was determined by carrying out the reaction at varying partial pressures of the reactant gases. The following rate equation was established for the reaction:

rate = 4.35*10^-5exp(-5150/T)*(P_NH3)^1.37(P_Ticl4)^-0.42

The titanium nitride thin …

Low Pressure Chemical Vapor Deposition Of Silicon Carbonitride Films From Tri(Dimethylamino) Silane, Rajive Shah

Theses

A literature study to investigate the incorporation of silicon into SiC and Si₃N₄ films from various organosilanes was carried out. The Arrhenius activation energy for the synthesis of silicon, silicon carbide and silicon nitride films from various organosilanes range from 165-210 kJ/mol. A review of recent studies have indicated that silicon deposition is the rate determining step in the synthesis of silicon from silane. It is proposed here that this hypothesis can be established for the synthesis of silicon carbide, silicon nitride and silicon carbonitride film. Limited experiments indicated that the silicon deposition is a rate determining …