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Theses/Dissertations

Nanoscience and Nanotechnology

University at Albany, State University of New York

2015

EUV

Articles 1 - 2 of 2

Full-Text Articles in Engineering

Organometallic Carboxylate Resists For Euv With High Sensitivity, James Passarelli May 2015

Organometallic Carboxylate Resists For Euv With High Sensitivity, James Passarelli

Nanoscale Science & Engineering (discontinued with class year 2014)

We have developed organometallic carboxylate compounds [RnM(O2CR’)2] capable of acting as negative-tone EUV resists. Overall, the best and fastest resists contain antimony, are pentavalent and the carboxylate group contains a polymerizable olefin (e.g. acrylate, methacrylate or styrenecarboxylate). Evidence suggests that high sensitivity is achieved through the polymerization of olefins in the exposed region. We have performed a systematic sensitivity study of molecules of the type RnM(O2CR’)2 where we have studied seven R groups, four main group metals (M), and three polymerizable carboxylate groups (O2CR’). We found that the greatest predictor of sensitivity of the RnSb(O2CR’)2 resists is their level of …


Nanoparticle Generation And Interactions With Surfaces In Vacuum Systems, Yashdeep Khopkar Jan 2015

Nanoparticle Generation And Interactions With Surfaces In Vacuum Systems, Yashdeep Khopkar

Legacy Theses & Dissertations (2009 - 2024)

Extreme ultraviolet lithography (EUVL) is the most likely candidate as the next generation technology beyond immersion lithography to be used in high volume manufacturing in the semiconductor industry. One of the most problematic areas in the development process is the fabrication of mask blanks used in EUVL. As the masks are reflective, there is a chance that any surface aberrations in the form of bumps or pits could be printed on the silicon wafers. There is a strict tolerance to the number density of such defects on the mask that can be used in the final printing process. Bumps on …