Engineering Commons^™

Stress Analysis Of Embedded Devices Under Thermal Cycling, Sadhana Radhakrishnan

Dissertations and Theses

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies.

Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical …

Probabilistic Stress Analysis Of Circular Fins Of Different Profiles, Sridhar Madhira Venkata

ETD Archive

The temperature distribution and thermal Stresses induced by a temperature difference for steady state heat transfer in silicon carbide (SiC) ceramic tube heat exchanger with circular fins was computationally simulated by a finite element method and probabilistically evaluated in view of the several uncertainties in the performance parameters. Cumulative distribution functions and sensitivity factors were computed for Hoop and Radial stresses due to the structural and thermodynamic random variables. These results are used to identify the most critical design variables in order to optimize the design and make it cost effective. The probabilistic analysis leads to the selection of the …

Probabilistic Stress Analysis Of Liquid Storage Tank, Khader A. Khan

ETD Archive

Liquefied Natural Gas transport and storage has become very important due to its ability to occupy 1/600th of the volume that compressed natural gas would occupy at room temperature and atmospheric pressure. In the present work, an LNG storage tank has been computationally simulated and probabilistically evaluated in view of the several uncertainties in the fluid, structural, material and thermal variables that govern the LNG storage tank. A finite element code ALGOR was used to couple the thermal profiles with structural design. The stresses and their variations were evaluated at critical points on the storage tank. Cumulative distribution functions and …

Finite Element Analysis Of Thermal Stresses In Semiconductor Devices, Joachim Karl Wilhelm Duerr

Dissertations and Theses

The failure of integrated circuit due to Silicon fracture is one of the problems associated with the production of a semiconductor device. The thermal stresses, which result in die cracking, are for the most part induced during the cooling process after attaching the die with Gold-Silicon solder. Major factors for stress generation in material systems are commonly large temperature gradients and substantial difference in coefficients of thermal expansion.