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A Study Of Direct Digital Manufactured Rf/Microwave Packaging, John W.I. Stratton
A Study Of Direct Digital Manufactured Rf/Microwave Packaging, John W.I. Stratton
USF Tampa Graduate Theses and Dissertations
Various facets of direct digital manufactured (DDM) microwave packages are studied. The rippled surface inherent in fused deposition modeling (FDM) fabricated geometries is modeled in Ansoft HFSS, and its effect on the performance of microstrip transmission lines is assessed via simulation and measurement. The thermal response of DDM microstrip transmission lines is analyzed over a range of RF input powers, and linearity is confirmed over that range.
Two IC packages are embedded into DDM printed circuit boards, and their performance is analyzed. The first is a low power RF switch, and the second is an RF front end device that …