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Testing And Packaging For Mems Acoustic Emission Sensors, Ting-Hung Liu
Testing And Packaging For Mems Acoustic Emission Sensors, Ting-Hung Liu
USF Tampa Graduate Theses and Dissertations
The goal of this research is to improve the structure and dimension of the MEMS acoustic emission sensor. Acoustic emission sensor (AE sensor) based on the piezoelectric transducer is a well-developed technology in non-destructive testing that is widely used to determine permanent damage such as cracks and corrosions in buildings and structures. The AE sensor can be used to monitor cracks in structures and to check leakage in pressurized systems. The location of cracks in a structure or system leakage causes a high-frequency surface vibration while releasing ultrasonic energy. The frequency of this energy is typically between 30 kHz to …